Category: Design engineering
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Solinide has launched LumiCOMB as a commercial optical comb source. The 2U instrument provides coherent O-band or C-band wavelength lines for photonics development.
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Emitech has developed medical EMC tests extending beyond six gigahertz. The method covers emerging wireless frequencies where standardised radiated-immunity testing currently stops.
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EV Group is expanding process support for co-packaged optics manufacturing. Its bonding, nanoimprint, and thin-wafer technologies target scalable photonic-electronic integration.
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IBM has completed its acquisition of quantum specialist HRL Laboratories. The deal adds silicon spin qubits, cryogenic control electronics, semiconductor processing, packaging, and interconnect expertise alongside IBM’s established superconducting quantum programme.
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TSMC is widening COUPE bandwidth through two silicon photonics paths. The roadmap increases channel rates and channel counts while adding wavelength multiplexing and deeper heterogeneous integration for AI interconnects.
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Finnish startup S-Transistors has raised €2.6m for superconducting electronics development. The VTT spinout plans cryogenic control prototypes, a pilot manufacturing line, and an initial multiplexer aimed at quantum-computing systems.
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Synopsys reported stronger quarterly growth led by Design Automation sales. Third-quarter revenue reached $2.477 billion as EDA, Ansys engineering software, and design IP supported higher full-year expectations.
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Beijing has launched a three-year AI4Chip semiconductor industry development programme. The plan applies artificial intelligence across IC design, wafer fabrication, packaging, test, equipment, materials, and supporting engineering infrastructure.
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Keysight software has more than halved AttoTude’s IC design cycles. The EDA workflow supports RF-to-THz silicon development, first-pass tape-outs, and per-lane interconnect designs reaching 800G.
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PewCB has introduced a desktop system for rapid PCB prototyping. PewCB One combines laser ablation, prepared two-sided ceramic blanks, and stencil cutting to shorten hardware iteration cycles.