Category: Design engineering
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JEDEC has released JEP203 and JEP204 for silicon carbide power semiconductors. The documents cover short-circuit evaluation and stress procedures, supporting more consistent qualification of SiC devices in EVs, industrial drives, renewable systems, and high-power electronics.
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QPT has opened customer demonstrations of MicroDyno. The GaN motor-drive platform now adds field-oriented control, dynamic cogging correction, digital-twin modelling, and edge-AI fault detection.
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Cadence has extended ChipStack to Level-5 autonomy. The AI Super Agent uses NVIDIA technology to automate chip design and verification workflows across simulation, formal analysis, debug, and convergence.
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Siemens has developed an AI data-centre reference design. The architecture covers electrical distribution, controls, modular power blocks, storage integration, and scalable deployment for NVIDIA Vera Rubin NVL72 infrastructure.
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A.R.T. and Space East will host a UK space-electronics event.
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Pickering will show EV test systems for battery electronics validation.
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Frenetic has appointed SZ Dore to support Asian magnetics customers.
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Nikon is preparing lower-cost ArF tools for semiconductor manufacturing markets.
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Tobii is providing webcam-based eye tracking for Lenovo’s tablet. The Legion Y900 13 uses Tobii Nexus software on a Qualcomm SoC to support multimodal AI interaction.
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ByteSnap Design will demonstrate embedded edge-AI vision at UK events. The system runs real-time object detection on embedded hardware without cloud processing, using an Infineon PSOC Edge device.