Category: Design engineering
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Lantek has added bevel-machining features to Expert V45 software today. The update improves mixed bevel design and shared cutting efficiency.
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Altus Group will bring Smart Klaus into UK assembly operations. The system supports guided manual work, optical checks, and traceability.
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IMRA America has demonstrated a higher-stability THz source architecture today. The 260GHz system combines electronic oscillation with optical reference locking.
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SYSGO has released ELinOS 8 for secure embedded deployments today. The platform adds SBOM generation, reproducible builds, ANSSI checks, and Linux 6.12 LTS.
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IHP has released a European open-source assembly design kit today. It links heterogeneous chiplet concepts with manufacturable 2.5D semiconductor assembly.
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Anglia has added 3PEAK’s analogue and mixed-signal component portfolio range. The deal expands UK and European access to signal-chain and power-management ICs.
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Socionext is now developing an A14 compute chiplet validation platform. The device will validate CPU and xPU architectures for AI infrastructure.
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APEM and Alps Alpine Europe are expanding industrial HMI collaboration. The work targets integrated controls for material handling, machinery, and off-highway equipment.
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STMicroelectronics is advancing edge imaging beyond conventional camera component boundaries. Its FlightSense and BrightSense platforms combine depth sensing, vision, local processing, and low-power operation.
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Panasonic has brought its PhotoMOS selector app to Android devices. The tool helps narrow more than 400 photo-coupled MOSFET relay options.