Category: Design engineering
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PureFize has demonstrated Far-UVC emission from a tunable platform today. The Swedish developer’s field-emission and cathodoluminescence approach targets compact disinfection systems below 240nm.
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Allegro DVT is backing the European CHASSIS automotive chiplet programme. Its video IP will help the 5nm base die handle camera, cockpit, and software-defined vehicle workloads.
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Nightfood has signed a semiconductor automation acquisition letter of intent. The proposed deal covers Taiwan-based Jiun Jiang Enterprise and TechForce Robotics.
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MKS is expanding Atotech manufacturing capacity for AI infrastructure demand. The Guangzhou investment targets semiconductor, advanced packaging, and PCB process equipment.
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Molex has launched HSAutoLink G for faster automotive Ethernet links. The connector system supports ADAS, LiDAR, radar, displays, and zonal architectures.
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Kingboard has raised funds to expand advanced PCB production capacity. The placement supports laminate, multilayer, HDI, and R&D investment.
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Somacis has completed the Group ACB deal, expanding PCB capacity. The move adds French and Belgian manufacturing sites to a wider high-reliability electronics platform.
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Keysight and WIN have linked GaN MMIC design workflows tightly. The environment joins simulation, layout verification, and evaluation-board optimisation before tapeout.
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SiTime has launched Chorus 2 timing devices for compute systems. The programmable clocks target AI clusters, networking, smart-factory vision, and heterogeneous boards.
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Lattice has brought CrossLinkU-NX SoM hardware into wider distribution channels. The FPGA board targets embedded vision, USB connectivity, sensors, and edge-AI prototyping.