Category: Design engineering
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ByteSnap Design has launched a cellular migration service aimed at moving legacy connected devices onto 4G LTE and newer networks, covering RF redesign, firmware, certification, and compliance.
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Vector has expanded its CANoe Test Package EV with automated security tests for charging communication, covering V2G fuzzing, TLS handling, and ISO 15118 workflows.
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Columbia Engineering has detailed a flexible brain-computer interface chip that combines dense neural recording, stimulation, telemetry, and wireless power on one implantable substrate.
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DigiKey is now stocking MIKROE’s full Click board portfolio worldwide, bringing more than 1,950 add-on boards, plus the surrounding mikroBUS, ClickID, and mikroSDK ecosystem, into a mainstream global channel for faster embedded prototyping and evaluation.
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Molex has agreed to acquire Teramount, adding detachable passive-alignment fiber-to-chip technology to its co-packaged optics stack as AI-driven data-centre optics moves closer to scale.
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Synopsys has rolled out a complete UFS 5.0, UniPro 3.0, and M-PHY v6.0 IP solution for next-generation storage, combining protocol, link, and physical layers in a single stack as edge-AI and automotive SoCs push storage bandwidth into a system-level constraint.
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AMD has signed a new letter of intent with the French government to expand AI infrastructure, training, and ecosystem support, while reinforcing its role in Alice Recoque, France’s planned first exascale supercomputer and a central platform in the country’s wider AI strategy.
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NVIDIA has launched its Ising model family for quantum calibration and error-correction decoding, signalling a deeper push into the classical computing layer around quantum systems.
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AliveCor has received CE mark for its Kardia 12L system, bringing a single-cable, AI-powered handheld 12-lead ECG platform to the European market.
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DELO has added five IBOA- and TPO-free adhesives for medical electronics, targeting wearable housings, sensor potting, sealing, and process control in compact device assemblies.