Category: Design engineering
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Quantum sensing is entering Europe’s semiconductor inspection production chain quickly. QuantumDiamonds will build a Munich test-equipment facility with €76m in German support.
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TDK has introduced 3D Hall switches for compact drive applications. HAL 13xy targets motor speed and direction sensing.
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Thintronics has been recognised for low-loss dielectric materials development work. Its materials target boards, packages, and semiconductor interconnect structures.
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La Luce Cristallina releases beta 200mm wafers for photonics evaluation. The BaTiO₃ platform targets low-voltage electro-optic modulator designs.
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Incap has added cleanroom assembly capability at its Slovak facility. The Námestovo site now supports ISO 6–7 controlled electronics production.
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TE Connectivity has expanded compact interconnect options for industrial designs. AMP SMC essential connectors target board-to-board and board-to-wire applications.
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Microchip has introduced a radiation-tolerant clock generator for spacecraft systems. The DSA504RT provides six programmable outputs for low-jitter aerospace and defence timing.
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Dialight will showcase industrial LED lighting for hazardous downstream sites. The display focuses on reliability, safety, efficiency, and harsh-environment operation.
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Inelco Hunter has added Amphenol liquid-cooling connectors for power-dense systems. The range targets AI data centres, EV charging, storage, and energy infrastructure.
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Saelig has introduced the Joulescope JS320 precision DC energy analyser. The instrument targets low-power embedded development, battery-life estimation, and firmware optimisation.