Category: Design engineering
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SRC has launched SPARC to accelerate industry-led semiconductor university research. The initial $13 million portfolio covers 21 projects spanning devices, manufacturing, advanced packaging, and analogue and mixed-signal technologies.
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Xen has launched a shared functional-safety engineering initiative for certification. AMD, EPAM, and Renesas are contributing requirements, architecture, testing, analysis, and process artefacts for downstream safety programmes.
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KTR has established an FR3 testbed using Anritsu’s MT8000A platform. The installation extends its 4G and 5G facilities towards 6G research, verification, standardisation, and future certification work.
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Avicena is now shipping 1Tbps LightBundle kits for customer evaluation. The microLED platform combines 335 optical channels at up to 3Gbps each, giving AI hardware developers a laboratory route to test short-reach optical links.
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Coherent has begun sampling 300mm silicon carbide substrates to customers. The material targets heat spreading in AI and HPC packaging, with the company claiming up to 25% better performance than current solutions.
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LitePoint has validated STMicroelectronics’ next-generation UWB silicon against emerging standards. Testing with IQgig-UWB+ covers PHY performance for the ST64UWB family as IEEE 802.15.4ab develops longer-range ranging and sensing capabilities.
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TASKING has demonstrated an AI-assisted workflow for safety-critical automotive development. The prototype connects semiconductor data, coding, testing, and compliance while keeping deterministic verification and human approval in the loop.
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Researchers propose a CMOS pixel architecture improving simulated near-infrared sensitivity. FDTD modelling reaches 0.94 optical efficiency at 1000nm without increasing silicon thickness.
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Zhen Ding and NTHU advance smart PCB manufacturing research together. Five projects address process optimisation, logistics, supply resilience, materials risk, and AI-enabled production management.
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Molex has invested in CAEPlus to advance active liquid cooling. BoundaryCool targets increasing processor heat loads in AI and high-performance computing infrastructure.