Category: Design engineering
-
SEMI will centre its materials conference on AI-era semiconductor constraints. The programme covers materials, packaging, quantum devices, manufacturing scale-up, and supply resilience.
-
Micron and Anthropic are linking AI infrastructure to memory architecture. Their agreement covers HBM, DRAM, SSDs, supply, and workload-level optimisation.
-
IBM has demonstrated sub-one-nanometre chip technology using a nanostack architecture. The research targets future gains in logic density, SRAM scaling, and energy efficiency.
-
Acbel is bringing integrated EV power conversion systems to Munich. The showcase includes 400V and 800V onboard charger and DC/DC converter architectures.
-
EU regulators are pushing energy labels deeper into digital data. The proposed changes would expand QR-linked product information and reduce paper-based documentation across energy-related products.
-
UK engineering companies are lagging on industrial productivity technology adoption. RAEng data shows 57% are not adopting assessed Industry 4.0 tools.
-
Quantinuum and HPE are linking quantum systems with HPC infrastructure. The collaboration covers architectures, workflows, interoperability, benchmarking, and customer use cases.
-
Europe is keeping advanced chip manufacturing in its policy frame. Chips Act 2.0 links logic, memory, packaging, design, and industrial demand.
-
AlixLabs has launched Sax Forma for advanced semiconductor patterning workflows. The platform brings atomic pitch splitting into customer evaluation and process validation.
-
GigaDevice and Qt are tightening industrial embedded GUI development workflows. The partnership brings Qt for MCUs support to the GD32H7 microcontroller platform.