Category: Design engineering
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Microelectronics US 2026 opens in Austin next week with more than 100 speakers across semiconductor, photonics, and embedded tracks, focusing on engineering execution rather than grandstanding around future technologies.
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Raytheon has demonstrated an event-based mid-wave infrared camera that tracks motion at pixel level rather than by processing full frames, cutting data load and power demand in high-speed sensing applications.
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Zephyr RTOS 4.4 brings WireGuard, Wi-Fi Direct, OpenRISC support, and a shift to Zephyr SDK 1.0 and C17, extending the open-source RTOS further into secure networking, open hardware, and embedded vision work.
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Advantech’s RSB-3810 has gained IEC 62443-4-2 certification, bringing secure-by-design credentials to an Arm-based industrial SBC built around MediaTek’s Genio 1200 platform for edge AI, machine vision, and automation workloads.
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Siemens advances pre-silicon AI verification to trillion-cycle prototype workloads faster.
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Safe and Secure targets critical infrastructure with auditable processor security.
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Microchip Technology and Sunny Smartlead have teamed up on ASA-ML-based ADAS camera modules, adding momentum to the push for standardised, secure, multi-vendor in-vehicle camera connectivity.
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Synopsys backs Artemis electronics modelling for lunar suits and connectivity.
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Emerson launches NI CHESS for lab-based aerospace RF link validation.
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Pickering Interfaces is using Microelectronics US 2026 to sharpen its push into semiconductor test, pairing modular switching hardware with a design environment intended to cut integration time and reduce the documentation burden in complex validation systems.