Category: Design engineering
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TPK and ASE are moving into through-glass via packaging with a pilot line planned for the third quarter of 2026, adding another sign that glass-core substrates are edging closer to practical deployment in high-performance semiconductor packaging.
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Collabora has refreshed Apertis for longer-life industrial embedded Linux designs. The v2026 release moves to Debian 13, adds Weston as default, and strengthens SDK and package maintenance workflows.
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Same Sky has further expanded its IP-rated USB Type-C range. The new additions span USB 2.0 to USB4, with reflow-compatible UV-glued O-ring models for sealed designs.
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ByteSnap’s new guide tracks how PCB priorities change by sector. The report moves from cost-led consumer layouts to industrial and aerospace boards shaped by harsher environments, tighter compliance, and longer validation cycles.
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March exposed where power in electronics now truly sits globally. Silicon still set the pace, but memory, power, optics, packaging, and design infrastructure increasingly shaped who could build, ship, and scale.
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Micron has launched its 3610 Gen5 QLC client SSD line. The drive combines PCIe Gen5 throughput, up to 4TB capacity, and stronger performance per watt for thinner AI-ready systems.
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Alexander Battery Technologies is expanding its battery engineering bench strength.
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Beko is putting AI deeper into the appliance development stack. Its latest R&D push points to a market where white goods are becoming connected, updateable electronics platforms shaped as much by software and sensing as by mechanics.
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AI hardware efficiency is pushing materials science back into focus. Cambridge researchers have developed a hafnium oxide memristor that could cut energy use in analogue in-memory computing.
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Taoglas is shrinking multi-radio antenna integration into tighter device footprints. Its new FXP30x and PC30x families combine cellular, GNSS, and Wi‑Fi support in flexible and rigid PCB formats for compact connected products.