Category: Design engineering
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Lotus Microsystems is targeting AI processors with vertical power delivery. The vStrata platform moves conversion closer to the load while integrating electrical and thermal design.
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TNO and ASML are scaling Europe’s photonic chip manufacturing base. The Eindhoven collaboration connects InP production, lithography, metrology, and process control.
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Infineon is virtualising automotive microcontroller evaluation through AWS infrastructure services. The platform supports early RISC-V assessment before physical hardware arrives.
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Integrals Power has validated UK-produced LFP material in cell testing. University of St Andrews work shows performance parity with Chinese equivalents.
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Atom Computing and Nu Quantum are linking quantum processor modules. The collaboration will combine neutral-atom systems with photonic quantum networking.
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Imagination Technologies is contributing GPU IP to automotive chiplet development. The European CHASSIS project is building a 5nm base die.
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Nearfield Instruments has raised €330m for semiconductor metrology expansion plans. The Dutch company is scaling inspection systems for advanced chip manufacturing.
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Mouser has expanded LoRa design resources for industrial IoT deployments. The hub covers LoRaWAN architecture, low-power wireless products, gateways, modules, sensors, eBooks, and technical content for distributed sensing systems.
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Aaronia has introduced magnetic RF connector systems at IMS 2026. The technology supports tool-free high-frequency connections, adapter sets, calibration workflows, and faster reconfiguration of microwave and millimetre-wave measurement setups.
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Microchip has opened European MASTERs Conference registration for embedded engineers. The Munich event covers MCU-to-MPU migration, Single Pair Ethernet, software, analogue, FPGAs, motor control, power conversion, and wireless design.