ROHM is turning SiC module evaluation into reusable inverter platforms. Three new reference designs package board-level design data around its latest modules across industrial and automotive power-conversion applications.
Sheffield is leading a new national semiconductor design centre. The £12.5 million programme will focus on heterogeneous systems, advanced integration, and shared design infrastructure for UK electronic systems development.
Keysight has extended optical component validation to 220 GHz. The new platform targets the measurement bottlenecks emerging around 1.6T and 3.2T optical transceiver development for AI and data centre interconnects.
CEA-Leti and NcodiN are taking optical interconnects wafer-scale. Their collaboration moves nanolaser-based photonic interposers onto a 300 mm silicon photonics process aimed at future AI and high-bandwidth computing packages.
Keysight and 3dB Labs have linked RF tools more tightly. The integration brings Keysight spectrum and FieldFox analysers into Sceptre, creating a unified workflow for signal monitoring, recording, playback, and post-event analysis.
Farnell has added Same Sky to its global distribution roster. The deal gives Same Sky wider reach through Farnell in EMEA, Newark in North America, and element14 in Asia Pacific.
digid is packaging nanoscale sensing for easier industrial system integration. The company is pairing microscopic force and temperature sensors with full integration and routing support.
Texas Instruments has launched two MCU families with integrated TinyEngine neural processing units, targeting low-cost edge AI inference and intelligent real-time motor-control applications.