Category: Design engineering
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NVIDIA has expanded its toolkit for AI assisted semiconductor engineering. Physics informed models, accelerated solvers, and deeper EDA integrations extend the platform across chip, package, and PCB development.
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Toray’s polymer film could substantially reduce lithium ion collector weight. The copper coated substrate is now being sampled from production equipment.
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Infineon’s configurable automotive eFuse brings software control to wire protection. SPOC Wire Guard supports zonal architectures, diagnostics, and fail operational systems.
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ST’s automotive IMU extends precise motion sensing across harsh environments. The device supports dead reckoning, telematics, V2X, and vibration monitoring.
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Keysight has certified RFPro for Intel’s latest advanced process technologies. RFIC designers can use process-aligned electromagnetic simulation before committing designs to manufacture.
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Microelectronics UK will bring five technical stages back to London. The programme covers semiconductors, photonics, embedded systems, edge AI, and engineering skills.
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Cadence and Synopsys have certified advanced Intel foundry design flows. The support spans implementation, sign-off, IP, multiphysics analysis, and heterogeneous packaging.
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Memory-safe languages correlate with lower embedded development and maintenance costs. A VDC study compares language decisions across safety-critical and real-time engineering programmes.
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Siemens is adding deterministic verification to long-running agentic EDA workflows. The system connects generative automation with established simulation, implementation, test, and sign-off engines for semiconductor and PCB development.
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LITILIT is expanding femtosecond-laser production for PFAS-free surface processing applications. Micro- and nanoscale texturing can replace selected fluorinated coatings and chemical treatments.