Category: Design engineering
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Flex Power Modules has released an 800W BMR684 converter variant. The quarter-brick isolated DC/DC module targets telecom RF power amplifier and datacom applications with 50V output and up to 96% efficiency.
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SAB Cables is highlighting high-flex cabling for automation system builders. The portfolio covers continuous-motion, drag-chain, compact control, data, and custom cable designs for robotics and machinery applications.
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Imec has demonstrated ferroelectric memory advances for future AI systems. The work targets density, voltage, endurance, and three-dimensional integration as AI compute architectures increase pressure on memory systems.
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Rapidus has signed a UK agreement on semiconductor manufacturing collaboration. The MoU links UK semiconductor strategy with Japan’s advanced 2nm logic manufacturing plans.
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Synopsys has released Multiphysics Fusion tools for chip design closure. The flows integrate timing, power, thermal, electromagnetic, multi-die, analogue, and photonic analysis.
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Xiphera is joining Finland’s SecureSoC programme for trusted semiconductor systems. The project links hardware cryptography, RISC-V design, AI-assisted verification, and supply-chain resilience.
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Legacy aerospace and satellite platforms face rising connectivity demands. Filtronic CTO Tudor Williams explains how solid-state power amplifiers can replace travelling wave tube amplifiers, improving reliability, reducing maintenance, and enabling higher-throughput links without the cost and complexity of full platform redesigns.
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Agile Analog and Xiphera are joining physical and cryptographic protection. Their collaboration combines anti-tamper sensor IP with post-quantum cryptographic cores.
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Keysight has expanded RF analysis options for wideband validation work. The XA5 and XA6 platforms target wireless, radar, and spectrum operations.
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Murata has added component models to Ansys simulation workflows directly. The Ansys-compatible files cover RF inductors, MLCCs, and power inductors.