AI data centres are turning NAND into a scarce resource. Phison is warning of a 2026 squeeze as enterprise SSD demand accelerates for inference, vector search, and cold-tier storage. With suppliers prioritising margin and process transitions limiting bit growth, embedded buyers may find eMMC and UFS harder to source.
Samsung has begun shipping HBM4 memory for AI accelerators commercially. The company says production uses a 10 nm-class DRAM process with a 4 nm logic base die, delivering 11.7 Gbps per pin, up to 3.3 TB/s per stack, and 24–36 GB capacities.
A recycled-titanium helicopter bracket has completed its first flight successfully. Laser powder bed fusion produced the part from aircraft scrap powder, demonstrating a route to qualified AM titanium feedstock inside the UK defence supply chain.
Ireland has launched I-C3 to accelerate custom chip design locally. The new competence centre, coordinated by Tyndall, will give startups and SMEs access to design tools, pilot lines, training, and funding routes under Europe’s Chips Act programme.
Taoglas has launched an AI antenna recommendation engine worldwide. The tool shortlists antennas using project constraints, aiming to cut early RF selection time and reduce late-stage redesign and certification churn.
TTTech will deliver 10Gb TSN networking for Army HADES jets. The contract covers a deterministic Ethernet platform and software intended to upgrade the ISR fleet’s digital backbone for high-throughput, time-bounded data transport.
Mastercam 2026.R2 shifts simulation workloads from CPU to GPU hardware. A new GPU-accelerated verifier and the Copilot assistant target faster toolpath checks and fewer repetitive edits, as the company moves to a twice-yearly major release cadence.