Category: Design engineering
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Tobii is providing webcam-based eye tracking for Lenovo’s tablet. The Legion Y900 13 uses Tobii Nexus software on a Qualcomm SoC to support multimodal AI interaction.
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ByteSnap Design will demonstrate embedded edge-AI vision at UK events. The system runs real-time object detection on embedded hardware without cloud processing, using an Infineon PSOC Edge device.
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LAPP will show industrial connectivity systems at Drives & Controls. The NEC exhibit will cover cabling, connectors, harnessing, EMC, OT security, and smart-factory integration.
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University researchers have validated bidirectional DC protection using SiC modules. The architecture targets medium-voltage DC grids, battery storage, renewable integration, vehicle-to-grid systems, and industrial power infrastructure.
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Synaptics has expanded access to its Astra Machina development kit. The SL2600 platform supports multimodal edge-AI prototyping across industrial, healthcare, robotics, IoT, and test applications.
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Samsung has begun shipping 12-layer HBM4E samples to major customers. The devices target AI accelerators and data-centre systems with 48GB stacks, 14Gbps pin speed, and up to 3.6TB/s bandwidth.
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Nextpower will acquire Prevalon Energy to expand its BESS platform. The deal adds battery storage hardware, intelligent controls, diagnostics, monitoring, and service capability for grid, data-centre, and industrial power systems.
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Würth Elektronik has expanded its digital isolator range for I²C. The WPME-CDI2C family adds bidirectional galvanic isolation for industrial, battery, motor-control, sensor, and embedded designs.
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Keysight has added executable workflow capture to RF design software. The RF Circuit Simulation Professional update turns simulations, optimisations, decision trees, and design parameters into reusable visual workflows and editable Python code.
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Glass-core substrates are gaining momentum in advanced semiconductor packaging roadmaps. SEMI and Global Net Corp. forecast rapid growth as AI and HPC designs push conventional substrate materials toward larger formats, finer interconnects, and tighter dimensional control.