Category: Design engineering
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Blueshift will bring low-outgassing thermal tapes to JEC World Paris. The company is positioning AeroZero tapes and flame barriers for lightweight spacecraft and aerospace electronics protection.
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Teledyne FLIR OEM has launched a new long-range thermal ISR camera. The Neutrino SX8 ISR 50-1000 extends detection ranges for border, perimeter, and counter-UAS applications, with a factory-integrated continuous zoom lens and AI-ready architecture.
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Richardson Electronics has added Nxbeam MMICs to its RF portfolio. A global agreement broadens access to GaN and GaAs devices up to 76 GHz for radar, satcom, and test equipment designs.
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Renesas has pushed Wi-Fi 6 into its RA6 combo MCUs. The RA6W1 and RA6W2 integrate Ceva wireless IP to reduce external radios, simplify PCB layouts, and cut BOM cost for IoT designs.
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Teledyne starts production of infrared modules for SDA Tracking Layer. The company says its radiation-hardened Focal Plane Modules will support Tranche 3 satellites designed to expand missile warning and tracking from Low Earth Orbit.
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EnSilica joins the CHERI Alliance to harden custom ASICs today. The mixed-signal supplier says it will use CHERI capability-based hardware techniques to strengthen memory safety for automotive and industrial silicon.
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UK Space Agency funded three studies for orbital materials manufacturing. Space Forge and OrbiSky will examine semiconductor seed crystals and ZBLAN fibre production in Low Earth Orbit, targeting higher-performance power electronics and lower-loss optical links.
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Rohde & Schwarz has pushed mid-range spectrum analysis to 44GHz. The new FPL1044 spans 10Hz to 44GHz and adds a 40MHz real-time spectrum analysis option across the FPL family, targeting Ka-band and adjacent high-frequency test workloads.
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LG will show 11MP diagnostic displays and 3D surgical monitors. At World Health Expo 2026 in Dubai, the company is highlighting a 40-inch 5,120 × 2,160 curved ultrawide diagnostic monitor and a 32-inch 3D surgical display aimed at procedural imaging.
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Edinburgh team reports a recoverable hexagonal germanium–tin semiconductor class today. The group used extreme pressure and heat to create stable GeSn alloys that could improve light–electricity conversion in optoelectronic components for processors, imaging systems, and data-centre hardware.