Category: Design engineering
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A Munich ruling strengthens Infineon’s position in ongoing GaN litigation. The decision restricts affected Innoscience products in Germany, adding another consideration to device qualification and long-term sourcing.
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Defence electronics programmes are sharpening semiconductor strategy and supply assurance. Long-lifecycle platforms need chips that can support radar, communications, electronic warfare, sensing, and control systems.
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Mouser is supporting a virtual conference for automation engineers globally. Control Automation Day 2026 will cover AI, robotics, machine vision, control systems, and industrial automation technologies.
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AI demand is reshaping memory allocation across semiconductor markets globally. SEMI has warned that intervention in memory markets could worsen supply pressure as HBM pulls capacity from conventional DRAM.
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Keysight and IEMN have advanced sub-THz indoor 6G research testing. The demonstration used reflective intelligent surface technology to support dual-polarised non-line-of-sight connectivity.
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Switzerland’s photonics manufacturing base is moving toward industrial production scale. CCRAFT has raised $7.8m to expand thin-film lithium niobate chip manufacturing in Neuchâtel.
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AI infrastructure is tightening board-level power delivery and thermal limits. Flex Power Modules has introduced the BMR353 eighth-brick intermediate bus converter for high-density data-centre designs.
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Backend semiconductor capacity is moving into the design conversation fast. SEMI and TechSearch International have expanded their assembly and test database to cover more than 820 global facilities.
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Microchip has removed licensing costs from core embedded development tools. MPLAB XC Pro Compilers and the MPLAB Machine Learning Development Suite are now available at no cost.
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Europe is linking AI adoption with tougher cybersecurity and compliance. Connected electronics developers now face clearer expectations on testing, resilience, vulnerability handling, and critical-sector deployment.