Category: Design engineering
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Keysight has introduced electrical-optical-electrical simulation in ADS 2026, allowing engineers to model complete high-speed optical links across transmitters, photonic circuits, and electrical receivers.
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Aetina will demonstrate edge AI systems for robotics, vision AI, cable assembly, and on-premise agentic workflows at COMPUTEX 2026.
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University of Arizona researchers have developed a 3D imaging approach that uses surrounding matte surfaces as a virtual screen for reflective objects.
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ByteSnap and Digi are extending embedded Linux security support into SBOM-led compliance for long-life medical and industrial IoT devices.
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Pickering will present modular RF and microwave switching systems at IMS 2026, including PXI/PXIe modules up to 110GHz.
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ATGBICS has developed a fly-by-fibre transceiver approach for defence drones operating in environments where wireless control links are degraded or denied.
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HighTec and SiFive are combining qualified compiler tooling with RISC-V processor IP to support safer automotive and industrial software development.
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Vision Engineering Group will show metrology, inspection, digital 3D imaging, and contract manufacturing capabilities at Smart Factory Expo 2026, targeting quality control, traceability, rework, and precision manufacturing workflows.
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Keysight and SRC UK are collaborating on electronic warfare test and simulation, combining EWASP scenario generation with local engineering, mission data, integration, training, and support for software-defined EW environments.
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IC-Link by imec has joined TSMC’s 3DFabric Alliance, strengthening access to 2.5D and 3D packaging technologies for advanced ASIC, photonics, AI, HPC, mobile, automotive, and telecom designs.