Category: Design engineering
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Semidynamics and SiPearl target sovereign European AI inference platforms.
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Rohde & Schwarz and Greenerwave have demonstrated a faster route to electronically steerable antenna characterisation. The near-field measurement setup captured a 50cm Ku-band SATCOM array in 32 minutes with close correlation against simulation.
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Rambus has introduced PCIe 7.0 Switch IP with time-division multiplexing, targeting scalable AI, cloud, and HPC systems requiring more efficient data movement across compute and storage resources.
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Keysight and CATARC New Energy Vehicle Inspection Center have established a Joint Innovation Laboratory for Charging Test Technology, covering charging validation, standards development, interoperability, and global compliance.
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TechWorks has announced international semiconductor participation at S2S26, with Canada’s Semiconductor Council bringing a delegation to the London summit.
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The University of Sheffield has hosted a major Tiny Tapeout workshop, giving more than 120 students from ten UK universities hands-on ASIC design and fabrication experience.
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Siemens has supported verification of Arm’s AGI CPU using Veloce Strato CS, targeting full-system validation for agentic AI and hyperscale compute workloads.
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IN Electronics Issue 2 is available to read in full. The Mar/Apr edition looks at electronic products designed for long service lives, where connectivity, validation, signal behaviour, software, and security have to remain supportable after release.
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Synopsys and TSMC have expanded advanced-node AI design enablement.
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GlobalFoundries has launched SCALE for co-packaged optical interconnects.