Category: Design engineering
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Oriole Networks is deploying photonic AI networking with AMD hardware. The UK startup’s PRISM platform will be tested inside ARIA’s Scaling Inference Lab for latency, throughput, and accelerator utilisation.
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Kimball Electronics has acquired Dutch medical CDMO Helvoet Polymer Technologies. The €90m deal expands micro-moulding and precision manufacturing capability for diagnostics, microfluidics, and drug delivery.
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Berlin researchers have reached certified CIGS-perovskite tandem cell efficiency records. The 25.5% result strengthens thin-film photovoltaic development where interfaces, stability, and manufacturable scale remain decisive.
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PureFize has demonstrated Far-UVC emission from a tunable platform today. The Swedish developer’s field-emission and cathodoluminescence approach targets compact disinfection systems below 240nm.
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Allegro DVT is backing the European CHASSIS automotive chiplet programme. Its video IP will help the 5nm base die handle camera, cockpit, and software-defined vehicle workloads.
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Nightfood has signed a semiconductor automation acquisition letter of intent. The proposed deal covers Taiwan-based Jiun Jiang Enterprise and TechForce Robotics.
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MKS is expanding Atotech manufacturing capacity for AI infrastructure demand. The Guangzhou investment targets semiconductor, advanced packaging, and PCB process equipment.
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Molex has launched HSAutoLink G for faster automotive Ethernet links. The connector system supports ADAS, LiDAR, radar, displays, and zonal architectures.
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Kingboard has raised funds to expand advanced PCB production capacity. The placement supports laminate, multilayer, HDI, and R&D investment.
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Somacis has completed the Group ACB deal, expanding PCB capacity. The move adds French and Belgian manufacturing sites to a wider high-reliability electronics platform.