Category: Design engineering
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XJTAG has released a free viewer for ODB++ PCB layouts.
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CEA-Leti will focus its summit on sustainable AI semiconductors.
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TactoTek has signed Suzhou Rixian Optical Technology as an IMSE licensee, adding local rapid-prototyping capability for automotive smart surface development in China.
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Dolphin Semiconductor and Perceptia Devices have formed a partnership combining power management, audio, monitoring, and PLL IP for complex mixed-signal SoC designs.
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Lumai has introduced Iris Nova, an optical AI inference server designed to run billion-parameter large language models in real time while reducing energy demand in data-centre deployments.
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MIKROE has added Renesas RA2E1 MCU support to mikroSDK 2.17.12, extending its embedded development framework with low-power Cortex-M23 devices, new board packages, and fixes for Renesas RA2 interrupt handling.
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MathWorks has released MATLAB and Simulink R2026a, adding Simulink Copilot and Polyspace Copilot to support model-based design, embedded software analysis, coding-rule checks, and development-to-verification workflows.
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SiPearl has appointed Guillaume Etorre as chief operating officer as the European processor developer prepares to move Rhea1 from development into market launch, strengthening its operational structure around chip design, reference systems, quality, and industrialisation.
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Bosch has started sampling third-generation silicon carbide power chips for electric vehicle drive electronics, targeting higher efficiency, improved power density, and smaller die sizes as automotive platforms move further into wide-bandgap semiconductor architectures.
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Siemens and TSMC have expanded their collaboration on AI-enabled semiconductor design automation, targeting advanced-node development, physical verification, DRC fixing, 3D IC design, and silicon photonics workflows.