Microchip has launched the MD-990-0011-B family of plug-in timing modules for data-centre servers and 5G vRAN platforms. The modules combine holdover, synchronisation, and environmental support functions on one card.
OMC is highlighting fibre-optic links for high-voltage applications where electrical isolation, interference resistance, and consistent link behaviour are critical. The company is producing matched optical links for demanding power-system environments.
Columbia Engineering has detailed a flexible brain-computer interface chip that combines dense neural recording, stimulation, telemetry, and wireless power on one implantable substrate.
Molex has agreed to acquire Teramount, adding detachable passive-alignment fiber-to-chip technology to its co-packaged optics stack as AI-driven data-centre optics moves closer to scale.
Synopsys has rolled out a complete UFS 5.0, UniPro 3.0, and M-PHY v6.0 IP solution for next-generation storage, combining protocol, link, and physical layers in a single stack as edge-AI and automotive SoCs push storage bandwidth into a system-level constraint.
AMD has signed a new letter of intent with the French government to expand AI infrastructure, training, and ecosystem support, while reinforcing its role in Alice Recoque, France’s planned first exascale supercomputer and a central platform in the country’s wider AI strategy.