Dolphin Semiconductor and Perceptia Devices have formed a partnership combining power management, audio, monitoring, and PLL IP for complex mixed-signal SoC designs.
Lumai has introduced Iris Nova, an optical AI inference server designed to run billion-parameter large language models in real time while reducing energy demand in data-centre deployments.
Bosch has started sampling third-generation silicon carbide power chips for electric vehicle drive electronics, targeting higher efficiency, improved power density, and smaller die sizes as automotive platforms move further into wide-bandgap semiconductor architectures.
Siemens and TSMC have expanded their collaboration on AI-enabled semiconductor design automation, targeting advanced-node development, physical verification, DRC fixing, 3D IC design, and silicon photonics workflows.
Microchip has launched the MD-990-0011-B family of plug-in timing modules for data-centre servers and 5G vRAN platforms. The modules combine holdover, synchronisation, and environmental support functions on one card.
OMC is highlighting fibre-optic links for high-voltage applications where electrical isolation, interference resistance, and consistent link behaviour are critical. The company is producing matched optical links for demanding power-system environments.