Category: Design engineering
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PDF Solutions has introduced Exensio Aurora for semiconductor manufacturing analytics. The architecture targets petabyte-scale data analysis, machine learning, edge integration, and controlled agentic AI deployment.
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SYNOPTICS has grown record-scale Yb:YLF crystal material for fusion lasers. A finished 127 mm slice will support DESY’s development of 200 J-class laser modules.
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IBM has connected two modular cryogenic systems for quantum scaling. The joined environment cooled below 15 millikelvin and provides substantially more wiring space for future multi-chip systems.
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Cornell researchers cut tantalum deposition temperatures using krypton sputtering techniques. The process forms the required bcc phase on silicon at 200°C and broadens compatibility with semiconductor fabrication.
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Nisshinbo has developed silicon packaging that integrates both board surfaces. Its window-comparator prototype cut mounting footprint by about 80 per cent while combining IC dies and passive components.
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Quell is positioning EESeal Builder around new MIL-STD-461H EMC requirements. The tool configures connector-level filters around pin assignments, signals, and interference frequencies.
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SUSTRONICS reduced medical electronics impacts through materials and design changes. Life cycle assessment guided sensor, substrate, and manufacturing decisions across European demonstrators.
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TDK has acquired OQmented assets to expand MEMS display development. The deal adds laser beam scanning IP and engineering expertise to TDK AIsight.
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LG has begun European deliveries of integrated 5G telematics hardware. The Release 16 platform combines a communications module with up to 12 antennas for production vehicles.
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Same Sky has detailed test enclosures for miniature speaker development. Three models provide approximately 1cc rear cavities for controlled evaluation of 15 × 11mm, 16 × 9mm, and 18 × 13mm speakers.