Category: Design engineering
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Quobly has raised €115m for silicon quantum computing systems development. The funding supports 300mm wafer processes, FD-SOI technology, and a full-stack architecture spanning qubits, control electronics, and software.
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Molex has added 25A power modules to AirBorn SInergy connectors. The hybrid platform combines power, RF, and high-speed data.
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Analogue Insight has opened engagement for low-power 32Gbps interconnect IP. The design targets co-packaged optics and silicon photonics.
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IQE and Tower have signed a multi-year InP epiwafer agreement. The supply deal supports silicon photonics for AI infrastructure.
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Fraunhofer has urged Germany to accelerate applied research-to-industry technology transfer. The call reflects growing pressure on industrial innovation.
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Imec, ASML, and TSMC have demonstrated industry-scale 2D transistor integration. The 300mm work points beyond silicon logic scaling.
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MIKROE has introduced Spatial Anchor R1 and S1 tracking modules. They add 6-DoF accessory tracking for visionOS industrial, simulation, and prototyping workflows.
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Anritsu has introduced Tensor, an AI-assisted vector network analyser platform. The source-per-port architecture supports RF, microwave, millimetre-wave, and sub-THz characterisation.
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Adhesive selection demands equal attention to material performance and process. Peter Swanson, Executive Chair and Founder at Intertronics, explains why production trials, surface preparation, dispensing, curing, and QA must shape adhesive specification.
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Our latest issue examines resilient electronics supply chains under pressure. It spans medical technology, AI-ready networks, component availability, data integrity, and connected-device compliance.