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FORTEC UK adds rugged railway edge computer

FORTEC UK adds rugged railway edge computer

British Army trials private 5G command network

British Army trials private 5G command network

IDS ruggedises STARVIS 2 machine vision cameras

IDS ruggedises STARVIS 2 machine vision cameras

ams OSRAM extends Kamper’s term through 2031

ams OSRAM extends Kamper’s term through 2031

Microchip MCU integrates configurable logic block

August 4, 2026
China strengthens chip layout-design protection

August 4, 2026
Skyworks merger clears US antitrust hurdle

August 4, 2026
IonQ closes acquisition of SkyWater foundry

August 4, 2026
Brewer Science brings ultrapure chemicals in-house

August 4, 2026
Runtime evidence anchors Arm AI optimisation

August 4, 2026
Faster detectors broaden nanoscale SEM analysis

August 4, 2026
FORTEC UK adds rugged railway edge computer

August 3, 2026

Latest industry news

Innodisk pushes DDR5 MRDIMMs to 12,800MT/s

31/7/2026

Innodisk has introduced 12,800MT/s DDR5 MRDIMMs for modern AI servers.…
Delta automotive charging reaches ASPICE Level 2

31/7/2026

Delta’s automotive charging process has reached ASPICE Capability Level 2.…
Infineon flash qualifies for ASPEED server controllers

31/7/2026

Infineon flash has qualified for ASPEED’s latest server management controller.…
Element14 opens smart home healthcare design challenge

31/7/2026

Element14 has opened a healthcare and smart home design challenge.…
Altus expands Redditch electronics manufacturing centre

31/7/2026

Altus is expanding its Redditch headquarters around connected production lines.…
BAE and Lockheed advance modular EW aircraft

31/7/2026

BAE Systems and Lockheed Martin are advancing a modular jammer.…

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Featured

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AI brings real-time intelligence to medical electronics
High-power delivery for industrial AI-ready networks
Dismantled: Q2 2026
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Latest issue

Features

How ASIC applications impact material considerations

Material choices are critical in the design and performance of ASICs. Ross Turnbull, Director of Business Development and Product Engineering at Swindon Silicon Systems, explains how material considerations vary across applications, and the importance of getting it right.

Jul 17

2026

AI brings real-time intelligence to medical electronics
Jul 14

2026

High-power delivery for industrial AI-ready networks
Jul 4

2026

Dismantled: Q2 2026
Jun 25

2026

Resilience as the cornerstone of medical device manufacturing
Jun 19

2026

IN Conversation: inserting next-gen connectivity into legacy platforms with Filtronic
Jun 18

2026

The manufacturing challenge facing scaling UAV developers

Electronics

—

British Army trials private 5G command network

The British Army has trialled private 5G across armoured platforms.…

ams OSRAM extends Kamper’s term through 2031
CEA-Leti moves AI architecture into three dimensions
Silicon wafer shipments rise 7.4% globally
Renesas pushes server MRDIMMs to 16,000MT/s
Infineon flash qualifies for ASPEED server controllers

Design engineering

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Palomino broadens AI interconnect roadmap through acquisition

Palomino has completed its acquisition of interconnect specialist Vega Links.…

China strengthens chip layout-design protection
Runtime evidence anchors Arm AI optimisation
Faster detectors broaden nanoscale SEM analysis
CEA-Leti moves AI architecture into three dimensions
Delta automotive charging reaches ASPICE Level 2

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