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Lattice brings AI assistance into FPGA design

Lattice brings AI assistance into FPGA design

MACOM launches 3.2T optical front-end chipset

MACOM launches 3.2T optical front-end chipset

GlobalFoundries expands SiGe capacity for Marvell optics

GlobalFoundries expands SiGe capacity for Marvell optics

Tower and NewPhotonics ship laser-integrated optical engines

Tower and NewPhotonics ship laser-integrated optical engines

Aetina links Jetson Thor AI with EtherCAT control

September 18, 2026
Report details Europe’s AI electronics manufacturing gap

September 18, 2026
Infineon adds dual gate driver for AI power

September 18, 2026
Prodrive ships 105MP Runix machine vision camera

September 18, 2026
Elmos extends Dortmund wafer capacity through 2028

September 18, 2026
Besi joins Tata advanced packaging build-out

September 18, 2026
Nexperia and Tata link front-end and packaging

September 18, 2026
MemryX and Lenovo expand Saudi edge AI

September 17, 2026

Latest industry news

Micron demonstrates 512GB DDR5 server module

17/9/2026

Micron has demonstrated a 512GB DDR5 module for future servers.…
Arteris extends NoC across multi-die chiplets

17/9/2026

Arteris has expanded its chiplet interconnect portfolio for multi-die designs.…
Cadence and ADI build next SHARC core

17/9/2026

Cadence Tensilica IP drives Analog Devices’ next SHARC processor architecture.…
BAE launches compact Shadow EW family

17/9/2026

BAE Systems has launched compact Shadow EW airborne electronics systems.…
BAE requalifies RH45 rad-hard ASIC platform

17/9/2026

BAE Systems will requalify its RH45 radiation-hardened ASIC design platform.…
Murata and Smart Eye fuse cabin sensors

17/9/2026

Murata and Smart Eye are combining radar with cabin cameras.…

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Featured

The race to move AI data at the speed of light
GDPR and the transformation of IoT security
AI brings real-time intelligence to medical electronics
High-power delivery for industrial AI-ready networks
Dismantled: Q2 2026

Latest issue

Features

How ASIC applications impact material considerations

Material choices are critical in the design and performance of ASICs. Ross Turnbull, Director of Business Development and Product Engineering at Swindon Silicon Systems, explains how material considerations vary across applications, and the importance of getting it right.

Jul 23

2026

GDPR and the transformation of IoT security
Jul 17

2026

AI brings real-time intelligence to medical electronics
Jul 14

2026

High-power delivery for industrial AI-ready networks
Jul 4

2026

Dismantled: Q2 2026
Jun 25

2026

Resilience as the cornerstone of medical device manufacturing
Jun 19

2026

IN Conversation: inserting next-gen connectivity into legacy platforms with Filtronic

Electronics

—

MACOM launches 3.2T optical front-end chipset

MACOM has launched a 3.2T optical front-end chipset platform today.…

GlobalFoundries expands SiGe capacity for Marvell optics
Tower and NewPhotonics ship laser-integrated optical engines
Report details Europe’s AI electronics manufacturing gap
Infineon adds dual gate driver for AI power
Micas expands Malaysian production for commercial CPO

Design engineering

—

Lattice brings AI assistance into FPGA design

Lattice has introduced an AI assistant for FPGA design flows.…

Keysight joins Verizon forum for 6G validation
Arteris extends NoC across multi-die chiplets
Cadence and ADI build next SHARC core
BAE requalifies RH45 rad-hard ASIC platform
Murata and Smart Eye fuse cabin sensors

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