Latest industry news
-
MIT twins chip fingerprints for authentication
MIT has demonstrated paired PUFs using standard CMOS fabrication steps.…
-
Ericsson bakes neural accelerators into radios
Ericsson is pushing AI inference deeper into 5G radio hardware.…
-
Danisense lifts isolation for 1kA sensing
Danisense has widened its DN1000ID range with higher isolation distance.…
-
Niobium FHE accelerator heads for 8nm
Niobium has lined up Samsung Foundry for FHE silicon production.…
-
Nordson targets traceable coating and soldering
Nordson will showcase coating and soldering systems at APEX 2026.…
-
Mouser broadens medical designs with u-blox Wi-Fi 6 modules
Mouser is shipping u-blox MAYA-W3 Wi-Fi 6 modules now globally.…
























