Dymax brings fast UV curing to APEX EXPO

Dymax brings fast UV curing to APEX EXPO

Dymax will demo UV curing workflows at APEX EXPO 2026. The booth programme centres on PCB-level adhesives, coatings, and maskants, pairing automated dispensing with UV/LED curing demonstrations aimed at reliability challenges including outgassing, component stability, and environmental protection.


IN Brief:

  • APEX EXPO’s exhibition runs 17–19 March 2026 in Anaheim, with electronics manufacturing process control back in the spotlight.
  • Dymax is focusing on integrated dispense-and-cure workflows for adhesives, coatings, encapsulants, and PCB maskants.
  • Reliability topics — outgassing, insulation, moisture protection, and wearables compatibility — are shaping materials selection as much as cure speed.

Dymax will exhibit at APEX EXPO 2026 at the Anaheim Convention Center in California, where it plans to demonstrate UV/LED light-curable materials and equipment aimed at electronics assembly and printed circuit board manufacturing. The company will be located at booth 3405, with on-stand process demonstrations intended to link material choice directly to dispensing and curing workflows on the production line.

The demonstration programme is built around light-curable adhesives, coatings, and maskants used at PCB level, with Dymax highlighting reliability and process repeatability as the design drivers. The company is setting the agenda around common assembly constraints: outgassing control, component stability during operation and transport, and longer-term protection of assemblies operating in demanding environments.

On the equipment side, Dymax plans to show automated dispensing using a Delta PVA 8 dispensing system to illustrate how light-curable materials fit into controlled, repeatable application routines during PCB assembly. The curing stage will use a BlueWave QX4 V2.0 LED curing unit, with the company describing a process where staking and bonding adhesives are applied to glass substrates and encapsulants are applied to flex circuits, followed by UV/LED exposure to achieve full polymerisation in seconds.

Material selection for high-reliability electronics is a consistent thread through Dymax’s APEX line-up. The company has flagged adhesives specified for low-outgassing requirements associated with space and LEO electronics, where contamination risk can drive strict material screening. It is also highlighting conformal coating options intended to provide electrical insulation and protect assemblies from moisture, heat, and broader environmental stresses that can degrade performance over time.

Dymax is also bringing formulations aimed at wearable electronics, including products developed without IBOA and with reduced skin-sensitising ingredients — a reminder that reliability targets increasingly include user-contact constraints and long-term comfort as well as electrical performance. Alongside these, the company plans to show SpeedMask maskants used to shield printed circuit boards prior to conformal coating and wave solder operations, with the emphasis on controlling where material goes and protecting areas that must remain clean for downstream process steps.

APEX EXPO’s programme spans design, PCB fabrication, assembly, test, and reliability, which makes it a natural venue for demonstrating materials-and-equipment pairings rather than materials in isolation. Dymax’s approach reflects that reality: show the dispense path, show the cure profile, and keep the conversation anchored to the failure modes engineers are tasked with preventing.

Dymax says technical representatives will be available throughout the exhibition to discuss application requirements, material selection, and process considerations, with the stand plan built around practical comparisons between manual and automated workflows, as well as curing approaches aligned to high-throughput manufacturing.


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  • Dymax brings fast UV curing to APEX EXPO

    Dymax brings fast UV curing to APEX EXPO

    Dymax will demo UV curing workflows at APEX EXPO 2026. The booth programme centres on PCB-level adhesives, coatings, and maskants, pairing automated dispensing with UV/LED curing demonstrations aimed at reliability challenges including outgassing, component stability, and environmental protection.