IN Brief:
- Microchip has launched the SAM9X75D5M automotive-qualified System-in-Package for graphics-heavy HMI designs.
- The device combines an Arm926EJ-S processor and 512 Mbit of DDR2 SDRAM in one package.
- It targets cockpit clusters, HVAC controls, EV chargers, and other designs moving beyond conventional MCU memory limits.
Microchip Technology has introduced the SAM9X75D5M, an automotive-qualified System-in-Package device that combines an Arm926EJ-S processor and 512 Mbit of DDR2 SDRAM in a single package for display-heavy HMI designs. The company is positioning the part as a hybrid MCU, bridging the gap between traditional microcontroller designs and more memory-hungry MPU-class systems.
Microchip said the device is qualified to AEC-Q100 Grade 2 and is intended for digital cockpit clusters, smart clusters for two- and three-wheelers, HVAC controls, and EV chargers. It supports displays up to 10 inches at XGA resolution, and provides MIPI DSI, LVDS, and parallel RGB display interfaces. The integration of processor and memory into one package is intended to reduce external DDR layout complexity and shrink the amount of board area consumed by graphics-capable embedded designs.
The SAM9X75D5M also brings CAN FD, USB, and Gigabit Ethernet with Time-Sensitive Networking, together with integrated 2D graphics and audio support. Microchip said the device is supported through MPLAB X and MPLAB Harmony, as well as graphics frameworks including LVGL, Altia, and Embedded Wizard. The part gives developers another route into richer HMI implementations without a full jump to a more complex external-memory architecture.
