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Memory

  • Featured story

    GlobalFoundries and RAAAM tape out GCRAM test chip

    GlobalFoundries and RAAAM tape out GCRAM test chip

    GlobalFoundries and RAAAM have taped out GCRAM test silicon successfully. Their FDX implementation targets 40% less memory area and power reductions reaching 60% against conventional SRAM.

    Read the full story: GlobalFoundries and RAAAM tape out GCRAM test chip

  • CEA-Leti scales FeRAM to 22nm

    CEA-Leti scales FeRAM to 22nm

  • CEA-Leti and GlobalFoundries extend FD-SOI work

    CEA-Leti and GlobalFoundries extend FD-SOI work

  • Semiconductor equipment billings rise on AI demand

    Semiconductor equipment billings rise on AI demand

  • Bull and Foxconn to manufacture AI systems in Europe

    Bull and Foxconn to manufacture AI systems in Europe

  • Longsys targets edge AI with memory modules

    Longsys targets edge AI with memory modules

  • Samsung ships 12-layer HBM4E samples

    Samsung ships 12-layer HBM4E samples

  • Micron ramps 1-alpha DDR4 in Virginia

    Micron ramps 1-alpha DDR4 in Virginia

  • Rambus targets DDR5 9600 client memory modules

    Rambus targets DDR5 9600 client memory modules

  • Nvidia revenue jumps as AI infrastructure demand accelerates

    Nvidia revenue jumps as AI infrastructure demand accelerates

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