Direct Insight launches DDR3L STM32MP2 module

Direct Insight launches DDR3L STM32MP2 module

Direct Insight has introduced a new STM32MP2 module for developers. The QSMP-20 is positioned as a pin-compatible upgrade path that avoids current DDR4 and DDR5 supply pressure.


IN Brief:

  • Direct Insight has introduced the QSMP-20 solder-down system-on-module.
  • The design pairs an STM32MP235 processor with DDR3L memory in a compact QFN-style footprint.
  • The module offers a pin-compatible upgrade path while easing exposure to current memory market pressure.

Direct Insight has introduced the QSMP-20, a compact solder-down system-on-module built around STMicroelectronics’ STM32MP235 processor and positioned as a drop-in, pin-compatible successor to the QSMP-15.

The new module keeps to the established QSMP family’s compact QFN-style format while stepping up processing capability. At its core is the STM32MP235, combining dual Arm Cortex-A35 processing with a Cortex-M33 coprocessor, integrated graphics capability, and a neural processing engine intended for edge AI and multimedia workloads. The combination is aimed at developers who need more local processing headroom without committing to a complete board redesign.

One of the sharper design decisions sits in the memory choice. The QSMP-20 uses DDR3L rather than moving directly to DDR4 or DDR5, giving the module a more stable supply position at a time when newer memory generations remain under pressure from AI infrastructure demand. ST has itself highlighted DDR3L support in the STM32MP2 series as a way of maintaining pricing and supply resilience while DDR4 and LPDDR4 markets remain tight.

Direct Insight says the module carries 512MB of DDR3L RAM and 4GB of eMMC in a 27mm by 27mm package with a height of 2.6mm. It supports a single 3.3V supply and exposes a broad range of interfaces including CAN-FD, UART, SPI, I²C, audio, Gigabit Ethernet, SD, USB, and MIPI-DSI. That leaves it well suited to compact embedded HMIs, secure edge nodes, instrumentation, and other designs that need Linux-class capability in a tightly controlled footprint.

The module is supplied with a dedicated development kit and Yocto Linux board support package, which gives developers a clearer route into evaluation and software bring-up. As embedded designs continue to absorb more graphics, connectivity, and local AI tasks, products such as the QSMP-20 show how much value still sits in careful module design, supply-chain pragmatism, and board-level compatibility.


Stories for you


  • Lattice brings AI assistance into FPGA design

    Lattice brings AI assistance into FPGA design

    Lattice has introduced an AI assistant for FPGA design flows. Prompt connects engineers’ chosen models and IDEs with Radiant compilation, simulation, implementation, and device documentation.


  • MACOM launches 3.2T optical front-end chipset

    MACOM launches 3.2T optical front-end chipset

    MACOM has launched a 3.2T optical front-end chipset platform today. Eight 448Gbps PAM-4 channels combine new receiver components with existing high-speed optical drivers.