IN Brief:
- Silicon Box has shipped more than one billion units from its panel-level advanced packaging factory in Singapore.
- Cumulative shipments have increased tenfold since the company passed 100 million units in October 2025.
- A $300 million Singapore capacity expansion is under way, with full equipment installation expected by 2028.
Silicon Box has shipped more than one billion semiconductor devices from its panel-level advanced packaging factory in Singapore, reaching the milestone less than a year after cumulative output passed 100 million units.
The company is targeting two billion units by the end of 2026, with current production serving applications spanning artificial intelligence, high-performance computing, automotive electronics, robotics, mobile devices, and space systems.
Silicon Box says shipment volume and revenue from the Singapore factory have increased roughly tenfold during the past 12 months. Cumulative output reached 500 million units in August, meaning the factory has added another 500 million shipments in roughly two months.
The production increase provides a volume marker for panel-level advanced packaging, an approach that moves semiconductor assembly from conventional circular wafer formats towards large rectangular panels. A larger processing area can accommodate more dies or packages during each manufacturing cycle, provided process uniformity and yield can be maintained across the panel.
Silicon Box has built its manufacturing model around chiplet integration and fine-pitch interconnect using this format. Chiplet architectures divide a larger semiconductor system into several smaller dies that can be manufactured separately and combined within a package, allowing individual functions to use different processes or die sizes.
Splitting a system in this way transfers more of the manufacturing challenge into packaging. Die placement, redistribution layers, moulding, interconnect formation, inspection, thermal behaviour, and final test all have to operate within tighter tolerances as the number of dies and interconnections increases.
Panel processing introduces its own mechanical constraints. A large rectangular substrate can warp during thermal cycles, while lithography, deposition, and redistribution-layer processes have to maintain dimensional control over a wider area than a conventional wafer. Handling equipment must move panels without introducing particles, mechanical damage, or alignment errors.
Those factors make sustained production volume a more useful indicator than an isolated demonstration package. Silicon Box began reporting high-volume manufacturing milestones in 2025, when shipments passed 100 million units. The company reported more than 250 million units by the first quarter of 2026 and 500 million in August before reaching the latest billion-unit figure.
The company has not published the exact package mix behind those figures. A shipment can range from a relatively straightforward device to a more complex multi-die package, so cumulative unit volume does not by itself provide a direct comparison with another advanced packaging operation.
Yield data is also not disclosed in percentage terms. Silicon Box states that high yield has been maintained during the production increase, but the absence of a detailed figure prevents comparison between package types, customer programmes, or other panel and wafer-level manufacturing approaches.
Capacity at the Singapore operation is still being expanded. Silicon Box began a $300 million enlargement programme at its Tampines Wafer Park site in May, with full capacity installation expected by 2028. The company also intends to double its workforce during 2026 and says hiring remains on track.
Increasing assembly output at that rate requires more than additional packaging tools. Inspection, electrical test, materials supply, logistics, process control, equipment maintenance, and engineering support all have to scale with production. A defect mechanism repeated across a large panel can affect many devices simultaneously, making statistical process control and early defect detection central to manufacturing economics.
The customer mix also reduces dependence on one end market. AI and high-performance computing are major drivers of advanced packaging investment because large accelerator systems require high-density integration and substantial memory bandwidth, but Silicon Box also lists automotive, mobile, robotics, and space programmes among its current shipment base.
Those markets impose different qualification and lifecycle requirements. Automotive and space components typically require longer validation and service periods than mobile electronics, while AI hardware can place greater emphasis on dense interconnect, power delivery, and thermal management. A common panel manufacturing platform therefore has to support several package architectures rather than one standard product.
Silicon Box is also developing manufacturing capacity outside Singapore, including a planned European operation in Italy. The current one-billion-unit total relates to the flagship Singapore factory, so the European programme does not contribute to the shipment figure announced in October.
The next target is considerably larger but close in time. Silicon Box expects cumulative shipments to double from one billion to two billion units before the end of 2026, while the $300 million Singapore expansion is still being installed.
Reaching that target will require the production rate achieved during the recent ramp to continue while additional capacity, people, test capability, and materials are brought into the operation. The billion-unit milestone establishes panel-level packaging at sustained industrial volume within Silicon Box’s factory; the next phase will show whether that scale can be maintained as package complexity and customer mix continue to expand.
