IN Brief:
- Infineon will present power semiconductor platforms at PCIM Europe 2026 for AI, robotics, electromobility, and infrastructure.
- The demonstrations span silicon, SiC, GaN, solid-state transformers, solid-state circuit breakers, software, and cybersecurity.
- AI data centres, electrification, and grid modernisation are pushing power conversion toward more integrated system architectures.
Infineon Technologies will use PCIM Europe 2026 in Nuremberg to present semiconductor platforms for power infrastructure, AI data centres, robotics, electromobility, and industrial energy systems.
The company’s exhibition programme will span silicon, silicon carbide, and gallium nitride devices, alongside software, design tools, and cybersecurity capabilities. Demonstrations will cover solid-state transformers, solid-state circuit breakers, high-voltage DC distribution, energy storage, uninterruptible power supplies, motor control, EV charging, robotics, and data-centre power conversion.
Power electronics is moving into the centre of infrastructure design as AI data centres, electrification, and distributed energy systems place heavier demands on conversion efficiency, thermal performance, grid connection, and system control. Higher rack power densities are challenging established data-centre distribution architectures, while EV charging, storage, and industrial automation are creating similar pressure across grid-facing equipment.
Infineon’s PCIM programme sits alongside its €91m European research role in Moore4Power, which is centred on heterogeneous integration across silicon, SiC, and GaN. That research direction aligns closely with the exhibition focus, where power devices are presented as part of wider conversion, protection, sensing, control, and communication systems.
Solid-state transformers and circuit breakers are expected to draw particular interest because conventional transformer and protection hardware is becoming a limiting factor in projects that require bidirectional power flow, compact footprints, faster fault response, and more active control of DC distribution. Semiconductor-based alternatives can respond faster and support more flexible energy routing, although they also bring demanding requirements around reliability, isolation, thermal management, and service life.
Wide-bandgap semiconductors are central to those designs. SiC is increasingly used in high-voltage, high-power conversion where switching efficiency and thermal performance can justify higher device cost. GaN is pushing into compact, higher-frequency power stages where reduced magnetic size and faster switching can improve density. Silicon remains critical in cost-sensitive, mature, and highly integrated parts of the system.
Robotics adds a different but connected layer to the same engineering challenge. Industrial robots combine motor control, sensing, embedded compute, safety functions, power management, and communications within compact platforms that must operate reliably in production environments. As autonomy and edge intelligence increase, drive efficiency and power conditioning become linked more closely to processing, perception, and thermal design.
Cybersecurity is also becoming part of the power electronics conversation. Connected converters, chargers, industrial drives, and grid equipment are no longer electrically isolated assets in the operational sense. They exchange data, receive updates, and interact with wider control systems, creating a need for secure firmware, authenticated communication, and lifecycle management across equipment that may remain in service for many years.
The most important change is the move away from component-by-component design. Power semiconductor suppliers are being pulled into broader electrical architectures where switching devices, gate drivers, sensors, controllers, firmware, protection, modelling tools, and security functions have to be engineered as a whole. PCIM Europe will provide a useful measure of how quickly that systems approach is becoming the default for infrastructure-scale power electronics.
