IN Brief:
- Microelectronics US 2026 will run in Austin on April 22–23 with three technical stages covering semiconductors, embedded systems, and photonics.
- The agenda is centred on real deployment constraints including packaging, thermal density, supply chains, functional safety, and embedded AI.
- With 100+ speakers, 150+ exhibitors, and free registration, the show is positioning itself as a practical engineering event rather than a roadmap exercise.
Microelectronics US will open in Austin on April 22–23 with an agenda built around the problems that are now shaping system design decisions in practice, from advanced packaging and thermal density through to supply-chain resilience, embedded AI integration, and secure deployment. Rather than leaning on distant roadmap language, the event is placing current engineering trade-offs at the centre of the programme.
The conference will run across three dedicated stages covering semiconductors, embedded systems, and photonics, with more than 100 speakers and 150 exhibitors expected at the Palmer Events Center. Organisers are also framing the event as a cross-stack meeting point, pulling together design, packaging, manufacturing, materials, and deployment under one roof, at a moment when those boundaries are becoming harder to separate in real products.
That emphasis is visible in the agenda. Sessions range from CHIPS Act implementation and resilient supply chains to advanced packaging, new materials, and AI system development, while the wider programme stretches into photonics, optical technologies, and embedded architectures. The speaker line-up includes technical and strategy figures from Ford, Honeywell, Stellantis, Cummins, Arm, BAE Systems, GlobalFoundries, and Sandia National Laboratories, which should keep the discussion grounded in deployed systems rather than theory alone.
The exhibition is also leaning into practical breadth. Confirmed participants include Edge Impulse, KEYENCE, yieldWerx, Pickering, TQ Systems USA, NTX Embedded, Drake Plastics, femtoAI, General Graphene, and others across tooling, design enablement, photonics, materials, and manufacturing support. Registration is free, with passes available through the event registration page.
