Electronics & Design Engineering News
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Molex has agreed to acquire Teramount, adding detachable passive-alignment fiber-to-chip technology to its co-packaged optics stack as AI-driven data-centre optics moves closer to scale.
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Same Sky expands IP-rated USB Type-C range
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Typhoon APKWS trial points to lower-cost counter-UAS option
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Microchip packs processor and DDR2 into automotive HMI SiP
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Transparent HMI film combines force and touch sensing
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NXP launches omlox starter kit for industrial RTLS
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Intel posts MLPerf inference gains with Xeon 6 and Arc Pro
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Reliable Robotics completes FAA detect-and-avoid tests
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Renesas rad-hard ICs fly on Artemis II
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ByteSnap maps the PCB design divide

