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Electronics & Design Engineering News

  • Featured story

    Molex moves for Teramount in CPO push

    Molex moves for Teramount in CPO push

    Molex has agreed to acquire Teramount, adding detachable passive-alignment fiber-to-chip technology to its co-packaged optics stack as AI-driven data-centre optics moves closer to scale.

    Read the full story: Molex moves for Teramount in CPO push

  • Same Sky expands IP-rated USB Type-C range

    Same Sky expands IP-rated USB Type-C range

  • Typhoon APKWS trial points to lower-cost counter-UAS option

    Typhoon APKWS trial points to lower-cost counter-UAS option

  • Microchip packs processor and DDR2 into automotive HMI SiP

    Microchip packs processor and DDR2 into automotive HMI SiP

  • Transparent HMI film combines force and touch sensing

    Transparent HMI film combines force and touch sensing

  • NXP launches omlox starter kit for industrial RTLS

    NXP launches omlox starter kit for industrial RTLS

  • Intel posts MLPerf inference gains with Xeon 6 and Arc Pro

    Intel posts MLPerf inference gains with Xeon 6 and Arc Pro

  • Reliable Robotics completes FAA detect-and-avoid tests

    Reliable Robotics completes FAA detect-and-avoid tests

  • Renesas rad-hard ICs fly on Artemis II

    Renesas rad-hard ICs fly on Artemis II

  • ByteSnap maps the PCB design divide

    ByteSnap maps the PCB design divide

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