IN Brief:
- Renesas has disclosed that its radiation-hardened ICs are flying on NASA’s Artemis II mission.
- The devices are used across Orion and SLS subsystems, covering avionics, launch safety, power, signal integrity, and computing.
- The update extends the company’s flight heritage in qualified space electronics ahead of future lunar missions.
Renesas Electronics has disclosed that its radiation-hardened ICs are being used on NASA’s Artemis II mission, which launched on April 1 as the first crewed lunar mission of the Artemis programme. The company said its Intersil-branded devices are deployed across multiple subsystems in both the Orion spacecraft and the Space Launch System rocket.
Renesas said the parts are used in avionics and the launch safety system, where they regulate and distribute power, maintain signal integrity, and support onboard computing. That places the announcement squarely in the core electronics of the mission rather than in a peripheral payload. Artemis II is intended to validate spacecraft systems, procedures, and crew performance in deep space ahead of later lunar missions.
The update also builds on earlier Artemis heritage. Renesas previously said hundreds of its radiation-hardened devices flew on Artemis I across functions including battery management, engine control, launch-abort electronics, controller boards, the main flight computer, power distribution, and display systems. For Artemis II, the company has not identified individual part numbers or device counts, but the disclosure adds another live mission reference for its long-established space portfolio spanning power conditioning, data transfer, protection circuitry, and telemetry, tracking, and control electronics.
