IN Brief:
- TDK will present passive components, sensors, and power technologies at PCIM Europe 2026.
- The showcase spans AI data centres, EV charging, traction inverters, energy storage, industrial drives, railway traction, and EMC testing.
- Power electronics design is moving towards tighter integration across grid input, conversion, sensing, protection, and point-of-load delivery.
TDK will use PCIM Europe 2026 to show component and system technologies for AI data-centre power, industrial drives, renewable energy, railway traction, EV charging, electric mobility, and EMC testing.
The company will exhibit at Booth 350 in Hall 9 at the NürnbergMesse exhibition centre from June 9 to 11. Its PCIM programme covers passive components, sensor solutions, DC/DC conversion, contactors, power capacitors, EMC products, and technical presentations around e-mobility, energy storage, AI data centres, and solid-state transformers.
For industrial and green-energy applications, TDK will show an inverter power stack using 3kV-rated ModCap capacitors and 3.3kV SiC MOSFETs, primarily targeting energy storage and heavy-duty vehicles. A further 2L-B6I inverter demonstrator uses MKP DC-link film capacitors and Infineon CoolSiC 2.3kV MOSFETs in XHP modules, with relevance to energy storage systems, wind and solar inverters, DC fast chargers, and solid-state transformer development.
The automotive section will include temperature and pressure sensors, embedded motor controllers, Hall- and TMR-based magnetic-field sensors, current sensors, traction-inverter demonstrators, aluminium nitride multilayer substrates, xEVCap film capacitors, InsuGate transformers, and an 11kW bidirectional onboard charging unit. In electrified vehicle design, those components increasingly sit inside one coupled system, where thermal behaviour, switching performance, sensing accuracy, and mechanical integration have to be considered together.
AI data-centre power will be another major strand. TDK is using a “grid to core” approach for high-density compute infrastructure, covering PSU, UPS, battery energy storage, point-of-load conversion, high-voltage DC distribution, and future solid-state transformer technologies. The booth will include aluminium electrolytic snap-in capacitors for 8kW and 12kW server PSU reference designs, MKP DC-link capacitors for modular SST concepts, HVC29 contactors for 800V DC distribution, and µPOL converters that can be stacked to deliver up to 200A for FPGAs, SoCs, and ASICs.
Power design in AI infrastructure no longer stops at the server PSU. Higher rack density, faster processors, and constrained cooling paths are pushing component choices across the full power chain. Grid input, intermediate conversion, local rails, switching protection, current sensing, and EMC behaviour now interact directly with mechanical design and operating cost.
The same discipline is visible in TDK-Lambda’s 1500W AC-DC industrial modules, where power density, PMBus monitoring, wide input range, and sealed-enclosure suitability are brought into a single platform. At PCIM, TDK is widening that idea across front-end conversion, high-voltage switching, sensing, local conversion, and compliance testing.
EMC remains a substantial part of the programme. TDK is expanding its accredited laboratory in Regensburg to almost 1,700 square metres, including 1,100 square metres for laboratories and measuring stations. At the booth, it will also show absorbers, sine-wave filters, and high-current power-electronics filters for applications up to 1500V and 1600A.
As switching speeds rise and power stages become denser, EMC has to move earlier in the design process. A high-efficiency converter that creates late-stage compliance problems can still force enclosure changes, filter redesign, board rework, or derating. TDK’s PCIM showcase points to a market where power electronics is being engineered as a complete chain, from high-voltage distribution down to the last millimetres around the processor.
