IN Brief:
- CEA-Leti’s LID World Summit 2026 will run from 23 to 25 June in Grenoble.
- The event will focus on sustainable chips, AI factories, lab-to-market commercialisation, and European semiconductor competitiveness.
- The programme includes 11 conferences, more than 160 speakers, 30 live demos, and an exhibition covering deep-tech startups and industry partners.
CEA-Leti will use its LID World Summit 2026 in Grenoble to examine sustainable semiconductor technologies for the next generation of AI factories.
The three-day event will take place from 23 to 25 June 2026 under the theme “Lab to Market with Sustainable Chips to Power the Next Wave of AI Factories.” It is the 28th edition of CEA-Leti’s annual summit and is expected to bring together more than 1,250 international attendees, 400 companies, more than 160 high-level speakers, 11 conferences, 30 live demos, 1,000m² of exhibition space, and 90 exhibitors, sponsors, and startups.
The programme focuses on the semiconductor industry’s transition from lab-to-fab structures towards lab-to-market models. That requires closer coordination between research institutes, pilot lines, equipment suppliers, foundries, design companies, startups, and end users. Manufacturing readiness, industrial partnerships, and commercial deployment sit alongside scientific progress.
The conference programme includes data and network/cloud convergence, semiconductors for computing, semiconductors for defence, cybersecurity, the FAMES Pilot Line, the RESOLVE Initiative, startups and investments, optical interconnects, disruptive digital interfaces, and technology talks focused on next-generation systems.
The event will also include an exhibitor showcase, live demonstrations, a startups corner, and a partners corner involving companies and organisations across the semiconductor ecosystem. Participants listed for the summit include senior figures from CEA-Leti, GlobalFoundries, FMC, Lam Capital, Murata, HP, ITRI, Sumitomo Electric Industries, Rapidus, Density AI, Soitec, ASML, STMicroelectronics, Siemens, HORIBA, AMD, Preferred Networks, SIA, Bosch, and Schneider Electric.
AI infrastructure is placing new demands on semiconductor technology. Advanced logic, memory bandwidth, power delivery, optical interconnect, packaging, and cooling capability must all improve together if compute systems are to scale efficiently. At the same time, energy use, materials intensity, fabrication resources, and system-level efficiency are under tighter scrutiny.
That combination changes how semiconductor innovation is assessed. Peak performance and process-node density remain important, but manufacturability, energy efficiency, materials use, and route to deployment increasingly determine whether a technology can reach market.
Europe’s semiconductor position forms an important backdrop. The region has strengths in research, equipment, power electronics, FD-SOI, materials, photonics, sensors, and industrial systems, while commercial scale-up remains a persistent challenge. Connecting laboratories, pilot lines, startups, and industrial partners is essential if research output is to become manufacturable technology.
The inclusion of the FAMES Pilot Line and RESOLVE Initiative reinforces the role of intermediate production routes. Pilot lines allow process integration, reliability testing, packaging development, and customer validation to progress before a technology reaches high-volume manufacturing.
Optical interconnects and disruptive digital interfaces also point to the pressure points in AI compute. Scaling is constrained not only by transistor performance, but by data movement, energy per bit, and system architecture. Silicon photonics, advanced packaging, and new interface technologies are becoming central to improving bandwidth density and reducing power consumption.
By placing sustainable chips and lab-to-market execution at the centre of the 2026 summit, CEA-Leti is concentrating on one of the hardest stages in semiconductor development: turning credible research into manufacturable technologies fast enough for AI, defence, healthcare, industrial, and communications markets.
IN Electronics is an official media partner of CEA-Leti’s LID World Summit 2026.
