Design engineering
The latest design engineering news and features, covering technology, business news and opinions. Read the latest news, innovations and views for everything from component to application level.
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Molex has agreed to acquire Teramount, adding detachable passive-alignment fiber-to-chip technology to its co-packaged optics stack as AI-driven data-centre optics moves closer to scale.
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Anglia takes Digi deeper into Nordic IoT markets
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Sheffield leads national chiplet design centre
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PLS extends MCU profiling beyond trace hardware
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Keysight takes optical component test to 220 GHz
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CEA-Leti and NcodiN push silicon photonics to 300 mm
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Keysight and 3dB Labs widen RF monitoring interoperability
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Farnell expands line card with Same Sky global distribution deal
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digid turns nanosensors into subsystems
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TI brings edge AI acceleration to microcontrollers with TinyEngine NPU