IN Brief:
- Canada’s Semiconductor Council will bring an international delegation to TechWorks’ S2S26 summit.
- The London summit will bring together NMI, DESN, AESIN, and IoTSF communities.
- The programme covers materials, manufacturing, systems integration, verification, cyber resilience, commercialisation, and global growth.
TechWorks has announced that Canada’s Semiconductor Council will bring an international delegation to the Semiconductors to Systems Summit 2026, adding a cross-border semiconductor and electronics systems dimension to the London event.
The S2S26 summit will take place in London on 26 August and is designed to bring together deep-tech leaders across the semiconductor and electronic systems ecosystem. The event brings the NMI, DESN, AESIN, and IoTSF communities together under one roof, with support from the UK Semiconductor Centre.
Canada’s Semiconductor Council represents companies, industry leaders, and policymakers across Canada’s semiconductor ecosystem. Its participation adds emphasis on collaboration, manufacturing capability, talent development, commercialisation, and strategic growth across semiconductor markets.
The summit programme is structured around four themes. The Build session, hosted by NMI, covers materials, manufacturing, devices, advanced packaging, process engineering, equipment development, and test. The Create session, hosted by AESIN and DESN, focuses on systems, integration, verification, mixed-signal design, software-defined systems, edge AI, sensing, smart power, and precise positioning, navigation, and timing.
The Secure session, hosted by IoTSF, examines cyber resilience, trust, quantum safety, identity, and regulation. The Scale session, hosted by the UK Semiconductor Centre, focuses on investment, commercialisation, international partnerships, resilient supply chains, academic translation, and workforce development.
The programme shows how semiconductor strategy is moving beyond wafer fabrication alone. National capability is increasingly measured across the chain from materials and devices through to design IP, packaging, embedded software, cybersecurity, systems integration, and product deployment. Countries without dominant high-volume leading-edge logic manufacturing still have critical roles in specialised design, advanced packaging, compound semiconductors, photonics, automotive electronics, and secure connected systems.
That context fits both the UK and Canada. Each has established research capability, specialist industrial clusters, and technology companies operating in parts of the value chain where integration and application expertise are as important as raw fabrication scale. Collaboration around design, verification, secure systems, and commercialisation can therefore carry practical weight for companies seeking partners, markets, and supply-chain options.
S2S26’s format also recognises that electronics development is increasingly multidisciplinary. A connected industrial product may involve mixed-signal design, sensing, smart power, wireless connectivity, embedded software, security certification, test, packaging, and production readiness. Treating those subjects as separate markets can obscure the engineering dependencies between them.
The Canadian delegation strengthens the summit’s international function at a point when semiconductor supply chains remain globally interdependent. Public funding, export controls, procurement policy, and resilience planning are pushing countries to strengthen domestic capability, but design teams still depend on global foundries, specialist tooling, IP suppliers, distributors, standards bodies, and packaging partners.
For UK semiconductor and electronics companies, the summit offers a route into discussions around collaboration, talent, commercialisation, and scale. The presence of Canada’s Semiconductor Council gives those discussions a wider industrial frame, particularly for businesses working in systems-led markets where national strategies have to connect with exportable products.
The London event will also test whether semiconductor policy can be translated into practical industry networks. Funding announcements and strategy documents set direction, but companies still need customers, engineers, design partners, test capability, manufacturing routes, and trusted routes into international markets. S2S26 is being positioned around that operational layer.
