Design engineering
The latest design engineering news and features, covering technology, business news and opinions. Read the latest news, innovations and views for everything from component to application level.
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Molex has agreed to acquire Teramount, adding detachable passive-alignment fiber-to-chip technology to its co-packaged optics stack as AI-driven data-centre optics moves closer to scale.
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Synopsys delivers complete UFS 5.0 IP stack for next-gen storage
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AMD deepens French AI partnership around Alice Recoque
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NVIDIA opens Ising models for quantum workflows
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AliveCor takes handheld 12-lead ECG into Europe
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DELO expands medical electronics adhesive range
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Microelectronics US 2026 sharpens focus on execution across chips, photonics, and embedded systems
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Raytheon demonstrates event-based infrared camera for high-speed target tracking
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Zephyr RTOS 4.4 adds WireGuard, Wi‑Fi Direct, and OpenRISC support
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Advantech and MediaTek secure IEC 62443 certification for RSB-3810