Design engineering
The latest design engineering news and features, covering technology, business news and opinions. Read the latest news, innovations and views for everything from component to application level.
-
Molex has agreed to acquire Teramount, adding detachable passive-alignment fiber-to-chip technology to its co-packaged optics stack as AI-driven data-centre optics moves closer to scale.
-

Siemens scales AI chip verification to trillion-cycle prototyping
-

Safe and Secure targets auditable chips for critical infrastructure
-

Microchip and Sunny Smartlead extend ASA-ML camera module ecosystem
-

Synopsys extends Artemis support with lunar EVA and RF modelling
-

Emerson launches NI CHESS for aerospace RF link validation
-

Pickering extends semiconductor test push with modular switching and design software
-

TPK and ASE target glass substrate pilot line for 3Q26
-

Same Sky expands IP-rated USB Type-C range


