Design engineering
The latest design engineering news and features, covering technology, business news and opinions. Read the latest news, innovations and views for everything from component to application level.
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Molex has agreed to acquire Teramount, adding detachable passive-alignment fiber-to-chip technology to its co-packaged optics stack as AI-driven data-centre optics moves closer to scale.
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Siemens scales AI chip verification to trillion-cycle prototyping
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Safe and Secure targets auditable chips for critical infrastructure
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Microchip and Sunny Smartlead extend ASA-ML camera module ecosystem
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Synopsys extends Artemis support with lunar EVA and RF modelling
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Emerson launches NI CHESS for aerospace RF link validation
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Pickering extends semiconductor test push with modular switching and design software
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TPK and ASE target glass substrate pilot line for 3Q26
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Collabora moves Apertis to Debian 13 base
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Same Sky expands IP-rated USB Type-C range