Category: Products
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onsemi and Geely Auto Group have expanded their collaboration around EliteSiC power technologies for next-generation electric and hybrid vehicle platforms.
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Amphenol RF has expanded its non-magnetic MCX connector series with new configurations for medical equipment, quantum computing hardware, and wireless modules.
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Teledyne FLIR Defense has certified Emesent’s Hovermap LiDAR payload for unmanned air, ground, and radiation-detection platforms, adding GPS-denied 3D mapping capability.
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Dolphin Semiconductor and Perceptia Devices have formed a partnership combining power management, audio, monitoring, and PLL IP for complex mixed-signal SoC designs.
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TES Electronic Solutions has expanded its power management IP portfolio for X-FAB’s XT018 process, adding bias current source and bandgap reference blocks for SoC designs.
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POLYN Technology has taped out its VibroSense engineering chip, bringing analogue neuromorphic processing closer to deployment inside tyres for real-time road-friction monitoring.
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Lumai has introduced Iris Nova, an optical AI inference server designed to run billion-parameter large language models in real time while reducing energy demand in data-centre deployments.
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Microchip has expanded its Trust Shield portfolio with the TS1800 Platform Root of Trust controller and TS50x secure boot controller, adding hardware-accelerated post-quantum cryptography for data centre, compute, defence, telecom, and infrastructure systems.
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Analog Devices has released its A²B 2.0 automotive audio bus devices to production, increasing full-duplex bandwidth to 98.3Mbps and adding Ethernet tunnelling support for next-generation in-vehicle audio and connectivity architectures.
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MIKROE has added Renesas RA2E1 MCU support to mikroSDK 2.17.12, extending its embedded development framework with low-power Cortex-M23 devices, new board packages, and fixes for Renesas RA2 interrupt handling.