Category: Products
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STMicroelectronics has started shipping China-made STM32 microcontrollers to customers now. Production begins with the STM32H7 family and is set to expand to STM32H5 and STM32C5 devices.
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Arrow has launched a 10BASE-T1S reference design platform for evaluation. The REF_SPE_T1S board combines Microchip, Bourns, and Amphenol hardware to help engineers assess Single-Pair Ethernet performance at the industrial edge.
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Inelco Hunter has added sealed coolant temperature sensors to distribution. The Amphenol devices target compact thermal loops across electrified systems and cooling architectures.
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Renesas has extended its GaN charging platform to 500W today. The new HWLLC architecture targets denser, cooler AC/DC designs across industrial, infrastructure, and connected systems.
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Power Integrations has pushed flyback conversion into higher output ranges. The new TOPSwitchGaN family targets applications that previously moved to more complex resonant architectures.
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SmartRay has brought reflective-surface inspection into its ECCO X family.
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Direct Insight has introduced a new STM32MP2 module for developers. The QSMP-20 is positioned as a pin-compatible upgrade path that avoids current DDR4 and DDR5 supply pressure.
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Infineon is packing more current into the AI power stage. Its latest TLVR module targets the growing board-level constraints inside AI servers, where power density, transient response, and thermal headroom are becoming central design limits.
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RANsemi has secured a tactical 5G baseband design win now. Its RNS802 SoC sits at the heart of Apeiroon’s deployable 4G and 5G systems for defence, public safety, and temporary private networks.
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Taoglas is shrinking multi-radio antenna integration into tighter device footprints. Its new FXP30x and PC30x families combine cellular, GNSS, and Wi‑Fi support in flexible and rigid PCB formats for compact connected products.