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Memory

  • Featured story

    GlobalFoundries and RAAAM tape out GCRAM test chip

    GlobalFoundries and RAAAM tape out GCRAM test chip

    GlobalFoundries and RAAAM have taped out GCRAM test silicon successfully. Their FDX implementation targets 40% less memory area and power reductions reaching 60% against conventional SRAM.

    Read the full story: GlobalFoundries and RAAAM tape out GCRAM test chip

  • 28nm SRAM macro tackles edge-AI overheads

    28nm SRAM macro tackles edge-AI overheads

  • DRAM constraints reshape future HBM configurations

    DRAM constraints reshape future HBM configurations

  • Samsung previews vertical memory architectures for AI

    Samsung previews vertical memory architectures for AI

  • MediaTek qualifies Infineon flash for C-X1 cockpits

    MediaTek qualifies Infineon flash for C-X1 cockpits

  • NEO combines SRAM and HBM replacement concepts

    NEO combines SRAM and HBM replacement concepts

  • PCIe 6 fabric joins switching and storage

    PCIe 6 fabric joins switching and storage

  • HBF standard links flash capacity with UCIe

    HBF standard links flash capacity with UCIe

  • UD Info targets configurable industrial memory

    UD Info targets configurable industrial memory

  • Renesas pushes server MRDIMMs to 16,000MT/s

    Renesas pushes server MRDIMMs to 16,000MT/s

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