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Memory

  • Featured story

    GlobalFoundries and RAAAM tape out GCRAM test chip

    GlobalFoundries and RAAAM tape out GCRAM test chip

    GlobalFoundries and RAAAM have taped out GCRAM test silicon successfully. Their FDX implementation targets 40% less memory area and power reductions reaching 60% against conventional SRAM.

    Read the full story: GlobalFoundries and RAAAM tape out GCRAM test chip

  • Innodisk pushes DDR5 MRDIMMs to 12,800MT/s

    Innodisk pushes DDR5 MRDIMMs to 12,800MT/s

  • Infineon flash qualifies for ASPEED server controllers

    Infineon flash qualifies for ASPEED server controllers

  • SK hynix starts HBM4 shipments in record quarter

    SK hynix starts HBM4 shipments in record quarter

  • Astute adds UTA modules amid memory pressure

    Astute adds UTA modules amid memory pressure

  • Samsung and Broadcom link HBM, foundry, and packaging

    Samsung and Broadcom link HBM, foundry, and packaging

  • Kioxia samples 332-layer BiCS Flash

    Kioxia samples 332-layer BiCS Flash

  • GigaDevice enters industrial EEPROM market

    GigaDevice enters industrial EEPROM market

  • Exascend extends industrial storage into PCIe 5.0

    Exascend extends industrial storage into PCIe 5.0

  • Semiconductor equipment sales head towards 9bn

    Semiconductor equipment sales head towards $229bn

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