Category: Design engineering
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SK hynix is accelerating capacity as HBM demand tightens again. The company is expanding near-term output via M15X and progressing its Yongin cluster plan, with the first fab scheduled for completion in May 2027 and designed to produce next-generation DRAM, including HBM.
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Fluorescent chloride sensors are moving from lab novelty to product. A Research and Markets report forecasts growth from $4.27bn in 2025 to $6.36bn by 2032, driven by new fluorophores, nanomaterials, and tighter digital integration.
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Enphase has started shipping GaN microinverters into US rooftops now. The IQ9N-3P targets 480Y/277V three-phase commercial solar, using GaN in the power stage to reach up to 97.5% efficiency and higher power density.
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Vertiv launches new configurations of its MegaMod HDX solution. The prefabricated infrastructure supports high-density computing environments, offering flexibility to meet escalating power and cooling needs. The compact solution supports up to 13 racks, while the combo solution accommodates up to 144 racks, with capacities reaching 10 MW globally.
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SGET has released an open FPGA module specification aimed at standardisation. The Open Harmonized FPGA Module specification targets reduced design complexity, improved portability, and vendor-neutral scaling across FPGA and SoC-FPGA platforms for industrial, communications, and embedded applications.
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STMicroelectronics has expanded Anglia’s franchise territory into Nordics and Baltics. The move extends authorised support for ST’s portfolio, backed by new local hires and Anglia Live e-commerce fulfilment across the region.
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SURF is rebuilding its backbone around a multi-vendor architecture strategy. HPE, Salumanus, and Nomios will deliver higher-capacity DWDM, coherent optics, and IP routing to support Dutch research and education.
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Aetina unveils advanced AI modules with NVIDIA Blackwell GPUs. The new MXM AI Accelerator Modules offer triple the AI performance of previous versions, enhancing capabilities for autonomous robots, unmanned vehicles, and smart manufacturing equipment. This marks a significant leap in edge AI computing, setting new industry standards.
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VORS targets multi-billion-pound opportunity in high-stakes sectors. Midlands-based specialists PP Control & Automation, ByteSnap Design, and Kasdon have launched VORS to accelerate time-to-market and ensure compliance in defence, medical, and life sciences industries. The collaboration promises streamlined project management and robust supply chain resilience.
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Material choices are critical in the design and performance of ASICs. Ross Turnbull, Director of Business Development and Product Engineering at Swindon Silicon Systems, explains how material considerations vary across applications, and the importance of getting it right.