Mouser is shipping u-blox MAYA-W3 Wi-Fi 6 modules now globally. The host-based range targets healthcare and industrial systems with SISO Wi-Fi 6/6E, Bluetooth Low Energy 5.4 with LE Audio support, multiple antenna options, and evaluation kits intended to accelerate integration.
Samsung has begun shipping HBM4 memory for AI accelerators commercially. The company says production uses a 10 nm-class DRAM process with a 4 nm logic base die, delivering 11.7 Gbps per pin, up to 3.3 TB/s per stack, and 24–36 GB capacities.
Northwestern has built a 3D electrode mesh for mini-brain organoids. The soft, shape-conformal framework wraps around organoids, enabling high-density recording and stimulation across most of the tissue surface.
CEA has demonstrated dynamic electro-optical routing for photonic interposers today. The 28 nm CMOS router sets up optical paths in 18 ns, targeting package-scale networking for chiplet systems.
Astute will showcase Mobile Mark antennas at Enforce Tac 2026. The Hall 9 presence positions UK-built RF hardware for European defence integrators seeking rugged, high-performance communications across specialist and conventional bands.
Samsung and Getmobil are launching a Turkish refurbished electronics programme. The partnership introduces doorstep buyback and trade-in, backed by a single digital infrastructure covering valuation, pickup, refurbishment, and resale.
A recycled-titanium helicopter bracket has completed its first flight successfully. Laser powder bed fusion produced the part from aircraft scrap powder, demonstrating a route to qualified AM titanium feedstock inside the UK defence supply chain.