Blueshift will bring low-outgassing thermal tapes to JEC World Paris. The company is positioning AeroZero tapes and flame barriers for lightweight spacecraft and aerospace electronics protection.
Renesas will license EPC’s eGaN for low-voltage power devices globally. The deal adds second-sourcing and aims to accelerate GaN adoption in AI power, robotics, and compact converters.
Samsung will co-develop chip processes at Applied’s new EPIC Center. The $5bn facility targets atomic-scale patterning, etch, deposition, and extreme 3D integration across logic and memory.
BorgWarner’s BMS contract expands to more EV platforms from 2029. A modular BMU–CMU architecture targets 800V packs, DC fast-charge communication, and ASIL D-oriented diagnostics.
Teledyne FLIR OEM has launched a new long-range thermal ISR camera. The Neutrino SX8 ISR 50-1000 extends detection ranges for border, perimeter, and counter-UAS applications, with a factory-integrated continuous zoom lens and AI-ready architecture.
Infineon is shipping isolated gate drivers aimed at SiC inverters. The 1ED301xMC12I family uses an opto-emulator input to replace optocouplers without a PCB redesign, while tightening timing, noise immunity, and switching behaviour.
ZOLL’s Zenix monitor-defibrillator has cleared the EU MDR process now. The approval supports European rollout of a touchscreen-based professional monitor/defibrillator for EMS and hospital teams, with real-time CPR and ventilation feedback features.
Richardson Electronics has added Nxbeam MMICs to its RF portfolio. A global agreement broadens access to GaN and GaAs devices up to 76 GHz for radar, satcom, and test equipment designs.
Renesas has pushed Wi-Fi 6 into its RA6 combo MCUs. The RA6W1 and RA6W2 integrate Ceva wireless IP to reduce external radios, simplify PCB layouts, and cut BOM cost for IoT designs.