TDK-Lambda has introduced a 1U 3.5kW hot-swap supply for industry. The HFE3500 series supports redundant rack configurations and parallel operation, targeting automation, ATE, and communications systems that need high-density bulk power with monitoring and control via PMBus.
Component obsolescence remains a persistent risk for electronics manufacturers globally. ByteSnap Design has launched a free interactive BOM Health Self-Assessment tool to help engineering leaders quantify their exposure and evaluate whether existing BOM management processes are sufficient before disruption occurs.
TactoTek has licensed IMSE manufacturing rights to GTV in Michigan. The deal positions a local partner to prototype and tool injection-moulded smart surfaces with integrated touch, lighting, and circuit structures for automotive and other sectors.
UCLA scientists cut flicker noise in nanowires for sensors dramatically. The team demonstrated an ultra-low-noise transport regime in quasi-1D materials, indicating a path toward higher-fidelity medical sensing and more stable quantum devices.
Cree LED is targeting brighter displays using less power now. Its OptiLamp components integrate driver and control intelligence inside each LED pixel, aiming to cut system complexity while improving image quality and long-term maintainability in large-format display deployments.
Keysight and Point2 are testing RF interconnects for AI clusters. The companies are using Keysight BERT and sampling scopes to characterise Point2’s e-Tube plastic-waveguide links at multi-terabit data rates.
The Switch has added a battery-interface current limiter for DC. Its Electronic Current Limiter clamps fault current in microseconds, helping hybrid and electric vessels keep DC-link voltage stable during battery-side faults.
Munich researchers have built Europe’s first 7nm AI chip prototype. The RISC-V, neuromorphic design targets ultra-low-power on-device inference, with an eye on security-sensitive industrial and medical workloads. TUM’s MACHT-AI centre is backing further tape-outs on advanced FinFET nodes.