Category: News
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SEMIFIVE reports rapid growth as custom ASIC production volumes increase. First-half bookings, manufacturing orders, and advanced-node IP revenue point to a broader production pipeline.
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LG is building its humanoid around NVIDIA robotics technology stack. Jetson Thor, Isaac GR00T, group-supplied hardware, and factory validation form the development programme.
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Flip Electronics adds Vishay parts to its authorised obsolescence channel. The agreement targets traceable end-of-life discrete semiconductors used in long-lifecycle electronic equipment.
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MetaOptics is taking metalens prototyping equipment into Stanford’s nanofabrication ecosystem. Its Direct Laser Writer targets rapid 4-inch-wafer prototypes and small-volume pilot production.
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Ezurio folds security and lifecycle support into embedded Linux BSPs. EZ BSP adds secure boot, signed updates, provisioning, and multi-year maintenance across its SOM portfolio.
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Microchip brings radiation-tolerant atomic timing to smaller satellite system designs. Space CSAC-SA65 combines 30 kRad tolerance, wide-temperature operation, and sub-120mW consumption.
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TIER IV is opening its autonomous-driving AI chip designs publicly. The JST-backed programme combines dedicated Transformer acceleration, open compiler tooling, and formal verification for edge systems.
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Lightmatter coalition formalises open architecture work for co-packaged optics systems. The 19-company OCP initiative is moving towards shared specifications for large, multi-vendor AI compute clusters.
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Quanta and Quantinuum bring manufacturing engineering into quantum hardware systems. Joint development targets modular infrastructure capable of supporting future commercially deployable fault-tolerant machines.
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Lam Research plans $3 billion expansion of semiconductor R&D laboratories. The five-year programme targets more than 50% additional experimental capacity across its global development network.