Category: News
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Coherent has begun sampling 300mm silicon carbide substrates to customers. The material targets heat spreading in AI and HPC packaging, with the company claiming up to 25% better performance than current solutions.
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Trossen integrates Stereolabs stereo vision into new Physical AI platforms. Workbench and Rivet combine synchronised GMSL2 cameras, Jetson AGX Orin compute, and bimanual manipulation hardware for robot-learning data collection.
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NXP has launched MCX A5 microcontrollers for secure industrial Ethernet. The Cortex-M33 family integrates 10BASE-T1S digital PHY capability, topology discovery, and post-quantum security while targeting long-life industrial edge nodes.
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LitePoint has validated STMicroelectronics’ next-generation UWB silicon against emerging standards. Testing with IQgig-UWB+ covers PHY performance for the ST64UWB family as IEEE 802.15.4ab develops longer-range ranging and sensing capabilities.
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TASKING has demonstrated an AI-assisted workflow for safety-critical automotive development. The prototype connects semiconductor data, coding, testing, and compliance while keeping deterministic verification and human approval in the loop.
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Researchers propose a CMOS pixel architecture improving simulated near-infrared sensitivity. FDTD modelling reaches 0.94 optical efficiency at 1000nm without increasing silicon thickness.
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Zhen Ding and NTHU advance smart PCB manufacturing research together. Five projects address process optimisation, logistics, supply resilience, materials risk, and AI-enabled production management.
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Molex has invested in CAEPlus to advance active liquid cooling. BoundaryCool targets increasing processor heat loads in AI and high-performance computing infrastructure.
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TTM Technologies has agreed a $1.1 billion Epiq Solutions acquisition. The transaction extends its manufacturing portfolio into software-defined radios, embedded computing, and space electronics.
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India has approved 31 additional electronics manufacturing projects across states. The package expands domestic production across components, materials, sub-assemblies, and manufacturing equipment.