Zollner has expanded its Zandt headquarters with new capacity. The building adds high-precision mechanics, cleaning, coating, and defence-related manufacturing capability.
Cicor has secured a major French defence electronics assembly programme. The award gives its French operation new electronic assembly work with revenue potential above €50m.
Blueshift is presenting PhaseBlue circuit material for RF PCB designs.
Microchip’s Armenian engineering team has gained advanced FPGA authorisation. The US export licence covers controlled semiconductor technology and related high-performance hardware, allowing approved engineers to work on selected FPGA programmes under defined compliance controls.
Marktech has expanded its COTS and custom photodetector and LED capabilities with transfer-moulded packaging technology. The platform targets defence and aerospace sensing, targeting, and optical alignment systems requiring compact, rugged, and repeatable optoelectronic packages.
Tessalia will produce advanced SiP components in France. The Foxconn, Radiall, and Thales joint venture targets aerospace, telecoms, automotive, and medical applications, with production planned from 2029 and annual output above 50 million components by 2033.