Category: Embedded systems
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Microchip has expanded its CLB-based PIC MCU range, combining programmable logic with embedded control on a single device. The new families target timing-critical designs in industrial, automotive, and motor-control systems.
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Espressif has unveiled the ESP32-S31, a dual-core RISC-V SoC combining Wi-Fi 6, Bluetooth 5.4, IEEE 802.15.4, Ethernet, and richer HMI support for next-generation connected devices.
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GigaDevice has introduced the GD32F5HC series, a Cortex-M33-based MCU family targeting HMI, industrial edge, and connected embedded systems with expanded memory and security resources.
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HEITEC has unveiled an OpenVPX board concept combining FPGA processing, Linux support, and optional Hailo acceleration, aimed at edge AI deployment in defence and other rugged embedded environments.
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ByteSnap Design has launched a cellular migration service aimed at moving legacy connected devices onto 4G LTE and newer networks, covering RF redesign, firmware, certification, and compliance.
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Vector has expanded its CANoe Test Package EV with automated security tests for charging communication, covering V2G fuzzing, TLS handling, and ISO 15118 workflows.
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QNX and NVIDIA have expanded their collaboration around NVIDIA IGX Thor, combining QNX OS for Safety 8.0 with the Halos Safety Stack for robotics, medical, and industrial systems. The move pushes mixed-criticality edge AI closer to a unified production platform.
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DigiKey is now stocking MIKROE’s full Click board portfolio worldwide, bringing more than 1,950 add-on boards, plus the surrounding mikroBUS, ClickID, and mikroSDK ecosystem, into a mainstream global channel for faster embedded prototyping and evaluation.
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Rochester Electronics is extending authorised availability of Infineon’s Neuron processors beyond end of life, keeping long-lived LonWorks control designs in production at a point where redesign is costly and, in many cases, there is no direct alternative for LON network communication.
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ADIOS has secured its first £1 million order while widening its stocked semiconductor offer across analogue and embedded parts, signalling stronger demand for alternative sourcing channels as price pressure, franchise consolidation, and lead-time concerns continue to unsettle the market.