Category: Industrial
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AI infrastructure management is becoming a rack-level electronics discipline now. KAYTUS has launched KSManage Ultra to monitor compute, power, networking, cooling, racks, and clusters.
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Rail inspection data is outgrowing manual depot transfer methods now. Westermo, Eviden, and Blu Wireless have demonstrated multi-gigabit mmWave train-to-ground communications for Deutsche Bahn.
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Power IC integration is moving further onto engineered substrates now. Soitec and ZenSemi will scale 300mm BCD-on-SOI production for AI, EV, robotics, storage, and industrial systems.
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TDK has introduced 3D Hall switches for compact drive applications. HAL 13xy targets motor speed and direction sensing.
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Vishay has introduced high-isolation optocouplers for 800V electric vehicle systems. VOLA617A targets chargers, converters, battery management, and industrial automation.
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Arrow has introduced an industrial AMR reference design platform package. The system combines ST electronics, NVIDIA compute, and ROS 2 software.
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Incap has added cleanroom assembly capability at its Slovak facility. The Námestovo site now supports ISO 6–7 controlled electronics production.
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TE Connectivity has expanded compact interconnect options for industrial designs. AMP SMC essential connectors target board-to-board and board-to-wire applications.
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Dialight will showcase industrial LED lighting for hazardous downstream sites. The display focuses on reliability, safety, efficiency, and harsh-environment operation.
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Inelco Hunter has added Amphenol liquid-cooling connectors for power-dense systems. The range targets AI data centres, EV charging, storage, and energy infrastructure.