Vertiv has opened a Malaysian facility for AI infrastructure manufacturing. The Johor site supports power, cooling, testing, and modular deployment.
Nightfood has signed a semiconductor automation acquisition letter of intent. The proposed deal covers Taiwan-based Jiun Jiang Enterprise and TechForce Robotics.
MKS is expanding Atotech manufacturing capacity for AI infrastructure demand. The Guangzhou investment targets semiconductor, advanced packaging, and PCB process equipment.
Toshiba has launched an 80V MOSFET for AI infrastructure power. The device targets switched-mode supplies in data centres, base stations, and industrial equipment.
OMRON has introduced high-voltage SiC relays for demanding switching applications. The G3VH range targets industrial drives, renewables, storage, and semiconductor test.
Somacis has completed the Group ACB deal, expanding PCB capacity. The move adds French and Belgian manufacturing sites to a wider high-reliability electronics platform.
Kyocera AVX has launched traction-grade capacitors for high-voltage converter platforms. The FFLK series targets EV traction, drives, and DC-link filtering.