Category: Industrial
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University of Arizona researchers have developed a 3D imaging approach that uses surrounding matte surfaces as a virtual screen for reflective objects.
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Vishay has introduced automotive-grade optocouplers with wider creepage and clearance distances for EV, solar inverter, and high-voltage isolation stages.
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ByteSnap and Digi are extending embedded Linux security support into SBOM-led compliance for long-life medical and industrial IoT devices.
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Pickering will present modular RF and microwave switching systems at IMS 2026, including PXI/PXIe modules up to 110GHz.
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ATGBICS has developed a fly-by-fibre transceiver approach for defence drones operating in environments where wireless control links are degraded or denied.
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HighTec and SiFive are combining qualified compiler tooling with RISC-V processor IP to support safer automotive and industrial software development.
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Innodisk has introduced a 10GbE LAN module portfolio for edge AI systems, combining M.2 and PCIe form factors with Intel Ethernet controllers, DPDK, PTP, SR-IOV, and wide-temperature options.
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SEMI FlexTech has opened a 2026 request for proposals covering flexible hybrid electronics, bonding reliability, 2D materials, and flexible energy storage, with Army Research Laboratory funding.
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TDK will use PCIM Europe 2026 to show passive components, sensors, contactors, µPOL converters, and power-stage technologies for AI data centres, electrification, industrial drives, and EV infrastructure.
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Allegro MicroSystems will demonstrate current sensing and isolated gate-driver technologies at PCIM 2026, targeting SiC and GaN power designs for AI data centres and 800V EV architectures.